参数资料
型号: PCF8594C-2T/02,118
厂商: NXP Semiconductors
文件页数: 21/21页
文件大小: 0K
描述: IC EEPROM 4KBIT 100KHZ 8SOIC
标准包装: 2,500
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 4K (512 x 8)
速度: 100kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 6.0 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
其它名称: 935195550118
PCF8594C2D-T
PCF8594C2D-T-ND
Philips Semiconductors
PCF8594C-2
512 × 8-bit CMOS EEPROM with I 2 C-bus interface
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
9
10
11
12
13
14
15
15.1
15.2
15.2.1
15.2.2
15.3
15.3.1
15.3.2
15.3.3
15.4
16
17
18
19
20
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Device addressing . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
I 2 C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 6
Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 6
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device addressing . . . . . . . . . . . . . . . . . . . . . . 7
Write operations . . . . . . . . . . . . . . . . . . . . . . . . 7
Read operations . . . . . . . . . . . . . . . . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
I 2 C-bus characteristics . . . . . . . . . . . . . . . . . . 11
Write cycle limits . . . . . . . . . . . . . . . . . . . . . . . 12
External clock timing . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Through-hole mount packages . . . . . . . . . . . . 16
Soldering by dipping or by solder wave . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
Surface mount packages . . . . . . . . . . . . . . . . 16
Re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
De?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
? Koninklijke Philips Electronics N.V. 2004.
Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 25 October 2004
Document order number: 9397 750 14221
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