参数资料
型号: PCM16XD0
厂商: Microchip Technology
文件页数: 11/18页
文件大小: 0K
描述: PROCESSOR MODULE FOR MPLAB-ICE
标准包装: 1
附件类型: 处理器模块
适用于相关产品: ICE2000
产品目录页面: 658 (CN2011-ZH PDF)
相关产品: DVA16XP282-ND - ADAPTER ICE 28DIP/SOIC/SSOP
Processor Module and Device Adapter Specification
6.2
TQFP/PLCC Device Footprints
FIGURE 6-3:
DVA DRAWING –
TQFP/PLCC device adapter footprints shown will
accept board stackers like Samtec series DWM 0.050
Pitch Stackers. These stackers can be soldered in
place during development/emulation and eliminate the
DOUBLE-ROW TQFP/PLCC
B
need for any other sockets.
w’
x
FIGURE 6-2:
DVA DRAWING –
SINGLE-ROW TQFP/PLCC
B
A
w
z’
z
y’
x’
y
w’
x
A
w
z’
z
y’
x’
y
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
0.028 DIA
w, x, y, z = TQFP Pin 1 location
w’, x’, y’, z’ = PLCC Pin 1 location
See Table 6-2 for A & B dimensions and
Pin 1 location.
PLATED-THRU
HOLES
0.960 1.160
0.050
0.028 DIA
PLATED-THRU
HOLES
0.050
C
C
0.960
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Device
44-Pin (TQFP)
64/68-Pin (TQFP/PLCC)
80/84-Pin (TQFP/PLCC)
C
0.800
0.960
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing of device is 80/84-pin TQFP/PLCC.
? 2006 Microchip Technology Inc.
DS51140M-page 11
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