参数资料
型号: PESD12VL1BA,115
厂商: NXP Semiconductors
文件页数: 14/15页
文件大小: 0K
描述: DIODE DUAL BI ESD PROT SOD323
产品培训模块: ESD Protection Diodes
ESD Standards and Products
标准包装: 1
电压 - 反向隔离(标准值): 12V
电压 - 击穿: 14.2V
功率(瓦特): 200W
电极标记: 双向
安装类型: 表面贴装
封装/外壳: SC-76,SOD-323
供应商设备封装: SOD-323
包装: 标准包装
产品目录页面: 1511 (CN2011-ZH PDF)
其它名称: 568-4022-6
NXP Semiconductors
PESDxL1BA series
Low capacitance bidirectional ESD protection diodes in SOD323
11. Legal information
11.1 Data sheet status
Document status [1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status [3]
Development
Quali?cation
Production
De?nition
This document contains data from the objective speci?cation for product development.
This document contains data from the preliminary speci?cation.
This document contains the product speci?cation.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “De?nitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com .
11.2 De?nitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modi?cations or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
of?ce. In case of any inconsistency or con?ict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation speci?cations and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
speci?ed use without further testing or modi?cation.
Limiting values — Stress above one or more limiting values (as de?ned in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/pro?le/terms , including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or con?ict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales of?ce addresses, please send an email to: salesaddresses@nxp.com
PESDXL1BA_SER_2
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 20 August 2009
14 of 15
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