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| 型号： | PF48F4000P0ZTQ0 |
| 厂商： | INTEL CORP |
| 元件分类： | PROM |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle |
| 中文描述： | 16M X 16 FLASH 1.8V PROM, 88 ns, PBGA88 |
| 封装： | 8 X 11 MM, 1 MM HEIGHT, LEAD FREE, SCSP-88 |
| 文件页数： | 4/102页 |
| 文件大小： | 1609K |
| 代理商： | PF48F4000P0ZTQ0 |
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1-Gbit P30 Family
April 2005
4
Intel StrataFlash
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
10.0 Read Operations
....................................................................................................................53
10.1
Asynchronous Page-Mode Read........................................................................................53
10.2
Synchronous Burst-Mode Read..........................................................................................53
10.3
Read Configuration Register ..............................................................................................54
10.3.1 Read Mode............................................................................................................55
10.3.2 Latency Count........................................................................................................55
10.3.3 WAIT Polarity.........................................................................................................57
10.3.4 Data Hold...............................................................................................................58
10.3.5 WAIT Delay............................................................................................................59
10.3.6 Burst Sequence.....................................................................................................59
10.3.7 Clock Edge ............................................................................................................59
10.3.8 Burst Wrap.............................................................................................................59
10.3.9 Burst Length ..........................................................................................................60
11.0 Programming Operations
..................................................................................................61
11.1
Word Programming.............................................................................................................61
11.1.1 Factory Word Programming...................................................................................62
11.2
Buffered Programming........................................................................................................62
11.3
Buffered Enhanced Factory Programming .........................................................................63
11.3.1 BEFP Requirements and Considerations..............................................................64
11.3.2 BEFP Setup Phase................................................................................................64
11.3.3 BEFP Program/Verify Phase.................................................................................64
11.3.4 BEFP Exit Phase...................................................................................................65
11.4
Program Suspend...............................................................................................................65
11.5
Program Resume................................................................................................................66
11.6
Program Protection.............................................................................................................66
12.0 Erase Operations
...................................................................................................................67
12.1
Block Erase.........................................................................................................................67
12.2
Erase Suspend...................................................................................................................67
12.3
Erase Resume....................................................................................................................68
12.4
Erase Protection.................................................................................................................68
13.0 Security Modes
.......................................................................................................................69
13.1
Block Locking......................................................................................................................69
13.1.1 Lock Block .............................................................................................................69
13.1.2 Unlock Block..........................................................................................................69
13.1.3 Lock-Down Block...................................................................................................69
13.1.4 Block Lock Status ..................................................................................................70
13.1.5 Block Locking During Suspend..............................................................................70
13.2
Selectable One-Time Programmable Blocks......................................................................71
13.3
Protection Registers ...........................................................................................................72
13.3.1 Reading the Protection Registers..........................................................................73
13.3.2 Programming the Protection Registers..................................................................73
13.3.3 Locking the Protection Registers...........................................................................74
14.0 Special Read States
.............................................................................................................75
14.1
Read Status Register..........................................................................................................75
14.1.1 Clear Status Register.............................................................................................76
14.2
Read Device Identifier ........................................................................................................76
相关PDF资料 |
PDF描述 |
|---|---|
| PF48F0P0ZTQ0 | Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-98 |
| PF48F2P0ZTQ0 | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle |
| PF48F3P0ZTQ0 | Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Pin; Insert Arrangement:12-10 |
| PF48F4P0ZTQ0 | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; No. of Contacts:10; Connector Shell Size:12; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle |
| PF48F0P0ZT00 | Circular Connector; Body Material:Aluminum; Series:PT00; No. of Contacts:41; Connector Shell Size:20; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Socket; Insert Arrangement:20-41 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PF48F4000P0ZTQ0A | 功能描述:IC FLASH 256MBIT 100NS 88-SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:StrataFlash™ 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
| PF48F4000P0ZTQE3 | 功能描述:IC FLASH 256MBIT 100NS 88SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:576 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:512M（64M x 8） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP 包装:托盘 其它名称:497-5040 |
| PF48F4000P0ZTQED | 制造商:Micron Technology Inc 功能描述:NOR Flash Parallel/Serial 1.8V 256Mbit 16M x 16bit 110ns 64-Pin EZBGA Tray |
| PF48F4000P0ZTQEJ | 功能描述:IC FLASH 256MBIT SCSP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:Axcell™ 标准包装:2,000 系列:MoBL® 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:16M（2M x 8，1M x 16） 速度:45ns 接口:并联 电源电压:2.2 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-VFBGA 供应商设备封装:48-VFBGA（6x8） 包装:带卷 (TR) |
| PF48F4400M0Y0B0 | 制造商:NUMONYX 制造商全称:Numonyx B.V 功能描述:Numonyx Wireless Flash Memory (W18) with AD Multiplexed IO |
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