参数资料
型号: PH5502B2NA1-Y-A
厂商: CEL
文件页数: 10/12页
文件大小: 0K
描述: SENSOR AMBIENT LIGHT
标准包装: 1
带接近传感器:
波长: 555nm
电源电压: 1.8 V ~ 5.5 V
电流 - 光(典型值): 230µA
输出类型: 电流
工作温度: -30°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-SMD,扁平引线
包装: 带卷 (TR)
A Business Partner of Renesas Electronics Corporation.
PH5502B2NA1-E4
Chapter Title
NOTES ON HANDLING
1. Recommended reflow soldering conditions
(including infrared reflow, convection reflow, and infrared + convection reflow)
(1) This product is dry-packed with desiccant in order to avoid moisture absorption.
(2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature
profile shown below.
(3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and
reel.
Baking conditions: Once, with tape and reel, 60 ± 5 ° C, 10 to 24 hours
After the baking process, this product must be stored under conditions of 30 ° C or below, 70% RH or below, and
reflow soldering must be done within 168 hours.
< Storage conditions after breaking seal >
? S t o r a g e c o n d i t i o n s
? Maximum storage period after breaking seal
: 3 0 ° C or below, 70% RH or below
: 168 hours (Second reflow soldering must be completed
within 168 hours.)
< Reflow soldering conditions >
? P e a k r e f l o w t e m p e r a t u r e : 2 6 0 ° C or below (Package surface temperature)
? M a x i m u m n u m b e r o f r e f l o w s : 2
? No repair by hand soldering
? Maximum chlorine content of rosin flux (percentage mass) : 0.2% or less
Recommended Temperature Profile of Reflow
Peak Temperature
260 ° C MAX.
255 ° C
Ramp-up rate 3 ° C/s MAX.
200 ° C
220 ° C
Ramp-down rate 6 ° C/s MAX.
150 ° C
R 0 8 D S 0 0 3 8 E J 0 1 0 0 R e v . 1 . 0 0
Oct 05, 2011
60 to 120 s
Time
8 min. MAX.
30 s or less
60 s or less
P a g e 1 0 o f 1 0
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