参数资料
型号: PHPM6B10E60D3
厂商: Motorola, Inc.
英文描述: Hybrid Power Module
中文描述: 混合动力模块
文件页数: 4/5页
文件大小: 129K
代理商: PHPM6B10E60D3
4
Motorola IGBT Device Data
RECOMMENDED PCB LAYOUT
VIEW OF BOARD FROM HEAT SINK
(All Dimensions Typical)
OPTIONAL NON–PLATED
THRU–HOLES FOR ACCESS
TO HEAT SINK MOUNTING
SCREWS (x2)
1.530
0.250
1.350
0.250
PACKAGE “SHADOW”
PLATED THRU–HOLES
(x16)
3.500
0.270
PIN 1
0.265
NON–PLATED THRU–HOLE
0.140
0.175
0.065
0.625
0.175
0.175
0.625
0.450
KEEP–OUT ZONES (x4)
0.270
Figure 2. Package Footprint
NOTE:
1. Package is symmetrical, except for a polarizing plastic post near pin 1, indicated by a non–plated thru–hole in the footprint.
2. Dimension of plated thru–holes indicates net size after plating.
3. Access holes for mounting screws may or may not be necessary depending on assembly plan for finished product.
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PHPM6B20E60D3 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:Hybrid Power Module
PHPM6B7E60D3 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:Hybrid Power Module
PHPM7A10S120DC3 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:Hybrid Power Module
PHPS1AL 制造商:Hubbell Wiring Device-Kellems 功能描述:ALMOND PAINTED STEEL 1 GANG RECTANGULAR