参数资料
| 型号： | PI5101-EVAL1 |
| 厂商： | Vicor Corporation |
| 文件页数： | 1/9页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD FOR PI5101 |
| 标准包装： | 1 |
| 系列： | Picor®, µRDS(on)FET™ |
| 主要目的： | 电源管理，O 环控制器/高端 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | PI5101 |
| 已供物品： | 板 |
| 其它名称： | 1102-1063 |
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PI5101
μR DS(on) FET TM Series
360μΩ , 5V/60A N-Channel MOSFET
Product Summary
Features
Symbol
Condition
Value
Ultra Low “micro - Ohm” R DS(on)
Extremely Low Gate Charge
Very Low Gate Resistance
High Density, Low Profile
Very Low Package Inductance
Low Thermal Resistance
Applications
I D
V (BR)DSS
R DS(on)
Q G
R G
L DS
T A = 25°C
I D = 5mA
V GS = 4.5V
V GS = 3.5V
V GS = 4.5V
60A DC
5V
360μΩ
380μΩ
65nC
0.1Ω
0.1nH
Max
Min
Typ
Typ
Typ
Typ
Typ
Power Path Management Solutions
Active ORing & Load Switches
High Current DC-DC Converters
Description
Patent Pending
4.1mm x 8mm x 2mm
Thermally Enhanced LGA
The PI5101 μR DS(on) FET
TM
solution combines a high-
for the same on-state resistance, reducing board space by
performance 5V, 360μΩ lateral N -Channel MOSFET with a
thermally enhanced high density 4.1mm x 8mm x 2mm
land-grid-array (LGA) package to enable world class
performance in the footprint area of an industry standard
SO-8 package. The PI5101 offers unprecedented figure-of-
merits for DC & switching applications. The PI5101 will
replace up to 6 conventional “SO - 8 form factor” devices
~80%. The PI5101 offers unprecedented figure-of-merit
for R DS(on) x Q G , gate resistance (R G ) and package
inductance (L DS ) outperforming conventional Trench
MOSFETs and enabling very low loss operation.
The PI5101 LGA package is fully compatible with industry
standard SMT assembly processes.
Maximum Rating and Thermal Characteristics ( T A = 25°C unless otherwise Specified)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Symbol
V DS
V GS
Limit
5
±5
Unit
V
V
Drain Current
Single Pulse Avalanche Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Continuous
Pulsed
T AV <100μs
T A = 25°C
T A = 70°C
I D
I DM
I AS
P D
T J , T STG
60
150
100
3.1
2
-55 to 150
A
A
A
W
W
°C
Thermal Resistance
(1)
Junction-to-Ambient
Junction-to-PCB
R θJ -A
R θJ -PCB
40
6
°C/W
°C/W
Lead Temperature (Soldering, 20 sec)
260
°C
Note 1: The thermal resistance is measured when the device is mounted on 1 inch square 4-layer 2-oz copper FR-4 PCB at 0LFM
and 40A load current
Picor Corporation ? picorpower.com
PI5101-00-LGIZ
Rev 1.0, Jan 25 th 2010
Page 1 of 9
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