参数资料
型号: PIC16C505-04E/SL
厂商: Microchip Technology
文件页数: 54/90页
文件大小: 0K
描述: IC MCU OTP 1KX12 14SOIC
产品培训模块: Asynchronous Stimulus
标准包装: 57
系列: PIC® 16C
核心处理器: PIC
芯体尺寸: 8-位
速度: 4MHz
外围设备: POR,WDT
输入/输出数: 11
程序存储器容量: 1.5KB(1K x 12)
程序存储器类型: OTP
RAM 容量: 72 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
包装: 管件
配用: 309-1086-ND - ADAPTER 14-ZIF BD W/14-SO PLUGS
309-1085-ND - ADAPTER 14-DIP BD W/2 14-SO PLUG
309-1001-ND - ADAPTER 14-SOIC TO 14-DIP
309-1000-ND - ADAPTER 14-SOIC TO 14-DIP
PIC16C505
DS40192D-page 58
1999-2012 Microchip Technology Inc.
10.1
DC CHARACTERISTICS:
PIC16C505-04 (Commercial, Industrial, Extended)
PIC16C505-20(Commercial, Industrial, Extended)
DC Characteristics
Power Supply Pins
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0
C TA +70C (commercial)
–40
C TA +85C (industrial)
–40
C TA +125C (extended)
Parm.
No.
Characteristic
Sym
Min
Typ(1)
Max
Units
Conditions
D001
Supply Voltage
VDD
3.0
5.5
V
D002
RAM Data Retention
Voltage(2)
VDR
1.5*
V
Device in SLEEP mode
D003
VDD Start Voltage to ensure
Power-on Reset
VPOR
—VSS
V
See section on Power-on Reset for details
D004
VDD Rise Rate to ensure
Power-on Reset
SVDD
0.05*
V/ms
See section on Power-on Reset for details
D010
Supply Current(3)
IDD
0.8
0.6
3
4
4.5
19
1.4
1.0
7
12
16
27
mA
A
FOSC = 4MHz, VDD = 5.5V, WDT disabled (Note 4)*
FOSC = 4MHz, VDD = 3.0V, WDT disabled (Note 4)
FOSC = 10MHz, VDD = 3.0V, WDT disabled (Note 6)
FOSC = 20MHz, VDD = 4.5V, WDT disabled
FOSC = 20MHz, VDD = 5.5V, WDT disabled*
FOSC = 32kHz, VDD = 3.0V, WDT disabled (Note 6)
D020
Power-Down Current (5)
IPD
0.25
0.4
3
5
4
5.5
8
14
A
VDD = 3.0V (Note 6)
VDD = 4.5V* (Note 6)
VDD = 5.5V, Industrial
VDD = 5.5V, Extended Temp.
D022
WDT Current(5)
IWDT
—2.2
5
AVDD = 3.0V (Note 6)
1A
LP Oscillator Operating
Frequency
RC Oscillator Operating
Frequency
XT Oscillator Operating
Frequency
HS Oscillator Operating
Frequency
Fosc
0
200
4
20
kHz
MHz
All temperatures
* These parameters are characterized but not tested.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25
C. This data is for design guidance only and is not tested.
2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus
rate, internal code execution pattern and temperature also have an impact on the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD;
WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode.
4: Does not include current through Rext. The current through the resistor can be estimated by the formula:
IR = VDD/2Rext (mA) with Rext in kOhm.
5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in
SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
6: Commercial temperature range only.
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