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参数资料
型号： PIC16F54T-I/SS
厂商： Microchip Technology
文件页数： 80/88页
文件大小： 0K
描述： IC MCU FLASH 512X12 20SSOP
产品培训模块： Asynchronous Stimulus
标准包装： 1,600
系列： PIC® 16F
核心处理器： PIC
芯体尺寸： 8-位
速度： 20MHz
外围设备： POR，WDT
输入/输出数： 12
程序存储器容量： 768B（512 x 12）
程序存储器类型： 闪存
RAM 容量： 25 x 8
电压 - 电源 (Vcc/Vdd)： 2 V ~ 5.5 V
振荡器型： 外部
工作温度： -40°C ~ 85°C
封装/外壳： 20-SSOP（0.209"，5.30mm 宽）
包装： 带卷 (TR)
2007 Microchip Technology Inc.
DS41213D-page 79
PIC16F5X
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
44
Lead Pitch
e
0.80 BSC
Overall Height
A
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
A
E
E1
D
D1
e
b
NOTE 1
NOTE 2
N
12 3
c
A1
L
A2
L1
α
φ
β
Microchip Technology Drawing C04-076B
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