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| 型号： | PIC16F877-20IPT301 |
| 英文描述： | Microcontroller |
| 中文描述： | 微控制器 |
| 文件页数： | 64/67页 |
| 文件大小： | 2723K |
| 代理商： | PIC16F877-20IPT301 |
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Rev. 2.0, 03/06/02, 58
3.10
Generating a Makefile
The HEW allows you to generate a makefile, which can be used to build parts of your workspace without HEW.
This is particularly useful of you want to send a project to a user who does not have the HEW or if you want to
version control an entire build, including the make components.
To generate a makefile:
1. Ensure that the project, which you want to generate a makefile for, is the current project.
2. Ensure that the build configuration that you want to build the project with is the current configuration.
3.
Select [Build>Generate Makefile].
4.
Once this menu has been selected a dialog is displayed which asks the user what parts of the workspace
need to be added to the make file. (See figure 3.23.)
5.
Select the radio button which is relevant for your make file and then click OK.
Figure 3.23: Generate makefile Dialog
The HEW will create a subdirectory “make” within the current workspace directory and then generate the
makefile into it. It is named after the selection, with a .mak extension for example the current project and
configuration(e.g. project_debug.mak). The executable HMAKE.EXE, located in the HEW installation directory,
is provided for you to execute the makefiles generated by the HEW. It is not intended to execute makefiles,
which have been user modified.
To execute a makefile:
1. Open a command window and change to the “make” directory where the makefile was generated.
2. Execute HMAKE. Its command line is HMAKE.EXE <makefile>.
Note:
The degree portability of a generated makefile is entirely dependent upon how portable the project itself
is. For example, any compiler options, which include full paths to an output directory or include file
directory, will mean that, when given to another user with a different installation, the build will probably
fail. In general use placeholders wherever possible – using a full, specific path should be avoided when
possible.
相关PDF资料 |
PDF描述 |
|---|---|
| PIC16F877-20IPT | 8-BIT MICROCONTROLLER |
| PIC16F877-20IPQ301 | Microcontroller |
| PIC16F877-20IPQ | 8-BIT MICROCONTROLLER |
| PIC16F877-20IP301 | Microcontroller |
| PIC16F877-20IP | 8-BIT MICROCONTROLLER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PIC16F87720P | 制造商:Microchip Technology Inc 功能描述: |
| PIC16F877A DEV KIT W/PCW | 功能描述:开发板和工具包 - PIC / DSPIC PIC16F877A EMBD C DEV KIT W/PCW RoHS:否 制造商:Microchip Technology 产品:Starter Kits 工具用于评估:chipKIT 核心:Uno32 接口类型: 工作电源电压: |
| PIC16F877A DEV KIT W/PCWH | 功能描述:开发板和工具包 - PIC / DSPIC PIC16F877A EMBD C DEV KIT W/PCWH RoHS:否 制造商:Microchip Technology 产品:Starter Kits 工具用于评估:chipKIT 核心:Uno32 接口类型: 工作电源电压: |
| PIC16F877A DEVELOPMENT BOARD KIT | 功能描述:DEVELOPMENT BOARD FOR PIC16F877A RoHS:否 类别:编程器，开发系统 >> 通用嵌入式开发板和套件（MCU、DSP、FPGA、CPLD等） 系列:- 标准包装:1 系列:PICDEM™ 类型:MCU 适用于相关产品:PIC10F206，PIC16F690，PIC16F819 所含物品:板，线缆，元件，CD，PICkit 编程器 产品目录页面:659 (CN2011-ZH PDF) |
| PIC16F877A DEVELOPMENT KIT | 功能描述:EMBEDDED C DEVELOPMENT KIT RoHS:否 类别:编程器，开发系统 >> 通用嵌入式开发板和套件（MCU、DSP、FPGA、CPLD等） 系列:PIC® 产品培训模块:Blackfin® Processor Core Architecture Overview Blackfin® Device Drivers Blackfin® Optimizations for Performance and Power Consumption Blackfin® System Services 特色产品:Blackfin? BF50x Series Processors 标准包装:1 系列:Blackfin® 类型:DSP 适用于相关产品:ADSP-BF548 所含物品:板，软件，4x4 键盘，光学拨轮，QVGA 触摸屏 LCD 和 40G 硬盘 配用:ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARDADZS-BFLLCD-EZEXT-ND - BOARD EXT LANDSCAP LCD INTERFACE 相关产品:ADSP-BF542BBCZ-4A-ND - IC DSP 16BIT 400MHZ 400CSBGAADSP-BF544MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542KBCZ-6A-ND - IC DSP 16BIT 600MHZ 400CSBGAADSP-BF547MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF547BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF544BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF542BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA |
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