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参数资料
| 型号： | PIC16HV540 |
| 厂商： | Microchip Technology Inc. |
| 英文描述： | Enhanced PIC16C54 EPROM-Based 8-Bit CMOS Microcontroller With On-Chip Voltage Regulator |
| 中文描述： | 增强PIC16C54的EPROM 8位CMOS微控制器，带有片上电压调节器 |
| 文件页数： | 10/67页 |
| 文件大小： | 2723K |
| 代理商： | PIC16HV540 |
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Rev. 2.0, 03/06/02, 9
2.
Build Basics
This chapter explains the general functions of the HEW whilst the more advanced features can be found in
chapter 3, “Advanced Build Features”.
2.1
The Build Process
The typical build process is outlined in figure 2.1. This may not be the exact build process, which your
installation of HEW will use as it depends upon the tools that were provided with your installation of HEW (e.g.
you may not have a compiler for instance). In any case, the principles are the same - each step or phase of the
build takes a set of project files and then builds them, if all succeeds then the next step or phase is executed.
Project
Object
Files
C
Source Files
Assembler
Source Files
Library
Files
Load
Module
BUILD
COMPILER
ASSEMBLER
LINKER
Figure 2.1: Typical Build Process
In the example shown in figure 2.1 the compiler is the first phase, the assembler is the second phase and the
linker is the third and final phase. During the compiler phase, the C source files from the project are compiled in
turn, during the assembler phase, the assembler source files are assembled in turn. During the linker phase all
library files and output files from the compiler and assembler phases are linked together to produce the load
module. This module can then be downloaded and used by the debugger functionality in HEW.
The build process can be customized in several ways. For instance, you can add your own phase, disable a phase,
delete phases and so forth. These advanced build issues are left to chapter 3, “Advanced Build Features”. In this
chapter, only the general principles and basic features will be detailed.
相关PDF资料 |
PDF描述 |
|---|---|
| PIC16LF627 | FLASH-Based 8-Bit CMOS Microcontrollers |
| PIC16LF627A | FLASH-Based 8-Bit CMOS Microcontrollers |
| PIC16LF627T | FLASH-Based 8-Bit CMOS Microcontrollers |
| PIC17CXX | EPROM Memory Programming Specification |
| PALCE16V8Z-25JC | EE CMOS Zero-Power 20-Pin Universal Programmable Array Logic |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PIC16HV540/JW | 功能描述:8位微控制器 -MCU .75KB 25 RAM 12 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16HV540-04/P | 功能描述:8位微控制器 -MCU .75KB 25 RAM 12 I/O 4MHz PDIP18 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16HV540-04/P | 制造商:Microchip Technology Inc 功能描述:IC 8BIT CMOS MCU 16HV540 DIP18 |
| PIC16HV540-04/SO | 功能描述:8位微控制器 -MCU .75KB 25 RAM 12 I/O 4MHz SOIC18 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16HV540-04/SS | 功能描述:8位微控制器 -MCU .75KB 25 RAM 12 I/O 4MHz SSOP20 RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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