参数资料
型号: PIC16LC505T-04I/SL
厂商: Microchip Technology
文件页数: 26/90页
文件大小: 0K
描述: IC MCU OTP 1KX12 14SOIC
产品培训模块: Asynchronous Stimulus
标准包装: 2,600
系列: PIC® 16C
核心处理器: PIC
芯体尺寸: 8-位
速度: 4MHz
外围设备: POR,WDT
输入/输出数: 12
程序存储器容量: 1.5KB(1K x 12)
程序存储器类型: OTP
RAM 容量: 72 x 8
电压 - 电源 (Vcc/Vdd): 2.5 V ~ 5.5 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
包装: 带卷 (TR)
其它名称: PIC16LC505T-04ISL
PIC16C505
DS40192D-page 32
1999-2012 Microchip Technology Inc.
7.3.1
MCLR ENABLE
This configuration bit when unprogrammed (left in the
‘1’ state) enables the external MCLR function. When
programmed, the MCLR function is tied to the internal
VDD, and the pin is assigned to be a I/O. See
FIGURE 7-6:
MCLR SELECT
7.4
Power-On Reset (POR)
The PIC16C505 family incorporates on-chip Power-On
Reset (POR) circuitry, which provides an internal chip
reset for most power-up situations.
The on chip POR circuit holds the chip in reset until VDD
has reached a high enough level for proper operation.
To take advantage of the internal POR, program the
RB3/MCLR/VPP pin as MCLR and tie through a resistor
to VDD or program the pin as RB3. An internal weak
pull-up resistor is implemented using a transistor. Refer
to Table 10-1 for the pull-up resistor ranges. This will
eliminate external RC components usually needed to
create a Power-on Reset. A maximum rise time for VDD
is specified. See Electrical Specifications for details.
When the device starts normal operation (exits the
reset condition), device operating parameters (voltage,
frequency, temperature, ...) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating parameters are
met.
A simplified block diagram of the on-chip Power-On
Reset circuit is shown in Figure 7-7.
RB3/MCLR/VPP
MCLRE
INTERNAL MCLR
WEAK
PULL-UP
RBWU
The Power-On Reset circuit and the Device Reset
Timer (Section 7.5) circuit are closely related. On
power-up, the reset latch is set and the DRT is reset.
The DRT timer begins counting once it detects MCLR
to be high. After the time-out period, which is typically
18 ms, it will reset the reset latch and thus end the on-
chip reset signal.
A power-up example where MCLR is held low is
shown in Figure 7-8. VDD is allowed to rise and
stabilize before bringing MCLR high. The chip will
actually come out of reset TDRT msec after MCLR
goes high.
In Figure 7-9, the on-chip Power-On Reset feature is
being used (MCLR and VDD are tied together or the
pin is programmed to be RB3.). The VDD is stable
before the start-up timer times out and there is no
problem
in
getting
a
proper
reset.
However,
Figure 7-10 depicts a problem situation where VDD
rises too slowly. The time between when the DRT
senses that MCLR is high and when MCLR and VDD
actually reach their full value, is too long. In this
situation, when the start-up timer times out, VDD has
not reached the VDD (min) value and the chip may not
function correctly. For such situations, we recommend
that external RC circuits be used to achieve longer
POR delay times (Figure 7-9).
For additional information refer to Application Notes
Power-Up Considerations” - AN522 and “Power-up
Trouble Shooting” - AN607.
Note:
When the device starts normal operation
(exits the reset condition), device operating
parameters (voltage, frequency, tempera-
ture, etc.) must be met to ensure operation.
If these conditions are not met, the device
must be held in reset until the operating
conditions are met.
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