参数资料
型号: PIC16LC72T-04I/SS
厂商: Microchip Technology
文件页数: 91/111页
文件大小: 0K
描述: IC MCU OTP 2KX14 A/D PWM 28SSOP
标准包装: 2,100
系列: PIC® 16C
核心处理器: PIC
芯体尺寸: 8-位
速度: 4MHz
连通性: I²C,SPI
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 22
程序存储器容量: 3.5KB(2K x 14)
程序存储器类型: OTP
RAM 容量: 128 x 8
电压 - 电源 (Vcc/Vdd): 2.5 V ~ 6 V
数据转换器: A/D 5x8b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 28-SSOP(0.209",5.30mm 宽)
包装: 带卷 (TR)
PIC16C72 Series
DS39016A-page 80
Preliminary
1998 Microchip Technology Inc.
13.2
DC Characteristics:
PIC16LC72/LCR72-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40C
≤ TA ≤ +85C for industrial and
0C
≤ TA ≤ +70C for commercial
Param
No.
Characteristic
Sym
PIC16C72
PIC16CR72
Units
Conditions
Min
Typ
Max
Min
Typ
Max
D001
Supply Voltage
VDD
2.5
-
6.0
2.5
-
5.5
V
LP, XT, RC (DC - 4 MHz)
D002*
RAM Data Retention
Voltage (Note 1)
VDR
-
1.5
-
1.5
-
V
D003
VDD start voltage to
ensure internal Power-
on Reset signal
VPOR
-
VSS
-
VSS
-
V
See section on Power-
on Reset for details
D004*
VDD rise rate to ensure
internal Power-on
Reset signal
SVDD
0.05
-
0.05
-
V/ms
See section on Power-
on Reset for details
D005
Brown-out Reset Volt-
age
Bvdd
3.7
4.0
4.3
3.7
4.0
4.3
V
BODEN bit in congura-
tion word enabled
D010
Supply Current
(Note 2,5)
IDD
-
2.0
3.8
-
2.0
3.8
mA
XT, RC osc conguration
FOSC = 4 MHz, VDD =
3.0V (Note 4)
D010A
-
22.5
48
-
22.5
48
A
LP osc conguration
FOSC = 32 kHz, VDD =
3.0V, WDT disabled
D015*
Brown-out Reset
Current (Note 6)
Ibor
-
350
425
-
350
425
A
BOR enabled VDD =
5.0V
D020
Power-down Current
(Note 3,5)
IPD
-
7.5
30
-
7.5
30
A
VDD = 3.0V, WDT
enabled, -40
°C to +85°C
D021
-
0.9
5
-
0.9
5
A
VDD = 3.0V, WDT dis-
abled, 0
°C to +70°C
D021A
-
0.9
5
-
0.9
5
A
VDD = 3.0V, WDT dis-
abled, -40
°C to +85°C
D023*
Brown-out Reset
Current (Note 6)
Ibor
-
350
425
-
350
425
A
BOR enabled VDD =
5.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1:
This is the limit to which VDD can be lowered without losing RAM data.
Note 2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specied.
Note 3:
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
Note 4:
For RC osc conguration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in kOhm.
Note 5:
Timer1 oscillator (when enabled) adds approximately 20
A to the specication. This value is from characterization and
is for design guidance only. This is not tested.
Note 6:
The
current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
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