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| 型号： | PIC16LF1828-E/P |
| 厂商： | Microchip Technology |
| 文件页数： | 3/101页 |
| 文件大小： | 0K |
| 描述： | IC MCU 8BIT 7KB FLASH 20PDIP |
| 标准包装： | 22 |
| 系列： | PIC® XLP™ mTouch™ 16F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 32MHz |
| 连通性： | I²C，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，POR，PWM，WDT |
| 输入/输出数： | 17 |
| 程序存储器容量： | 7KB（4K x 14） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 256 x 8 |
| RAM 容量： | 256 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 数据转换器： | A/D 12x10b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 20-DIP（0.300"，7.62mm） |
| 包装： | 管件 |
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2010-2011 Microchip Technology Inc.
Preliminary
DS41419C-page 11
PIC16(L)F1824/1828
Table of Contents
1.0
Device Overview ........................................................................................................................................................................ 13
2.0
Enhanced Mid-Range CPU ........................................................................................................................................................ 21
3.0
Memory Organization ................................................................................................................................................................. 23
4.0
Device Configuration .................................................................................................................................................................. 51
5.0
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 57
6.0
Reference Clock Module ............................................................................................................................................................ 75
7.0
Resets ........................................................................................................................................................................................ 79
8.0
Interrupts .................................................................................................................................................................................... 87
9.0
Power-Down Mode (Sleep) ...................................................................................................................................................... 101
10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 103
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 107
12.0 I/O Ports ................................................................................................................................................................................... 121
13.0 Interrupt-on-Change ................................................................................................................................................................. 141
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 145
15.0 Temperature Indicator Module ................................................................................................................................................. 147
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 149
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 163
18.0 SR Latch................................................................................................................................................................................... 169
19.0 Comparator Module.................................................................................................................................................................. 175
20.0 Timer0 Module ......................................................................................................................................................................... 185
21.0 Timer1 Module ......................................................................................................................................................................... 189
22.0 Timer2/4/6 Modules.................................................................................................................................................................. 201
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 205
24.0 Capture/Compare/PWM Module .............................................................................................................................................. 215
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 243
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 297
27.0 Capacitive Sensing Module...................................................................................................................................................... 325
28.0 In-Circuit Serial Programming (ICSP) ................................................................................................................................ 333
29.0 Instruction Set Summary .......................................................................................................................................................... 337
30.0 Electrical Specifications............................................................................................................................................................ 351
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 383
32.0 Development Support............................................................................................................................................................... 385
33.0 Packaging Information.............................................................................................................................................................. 389
Appendix A: Revision History............................................................................................................................................................. 409
Appendix B: Device Differences ........................................................................................................................................................ 409
Index .................................................................................................................................................................................................. 411
The Microchip Web Site..................................................................................................................................................................... 419
Customer Change Notification Service .............................................................................................................................................. 419
Customer Support.............................................................................................................................................................................. 419
Reader Response .............................................................................................................................................................................. 420
Product Identification System ............................................................................................................................................................ 421
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相关代理商/技术参数 |
参数描述 |
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| PIC16LF1828-I/ML | 功能描述:8位微控制器 -MCU 7 KB Flash 256B RAM 32 MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1828-I/P | 功能描述:8位微控制器 -MCU 7 KB Flash 256B RAM 32 MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1828-I/SO | 功能描述:8位微控制器 -MCU 7 KB Flash 256B RAM 32 MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1828-I/SS | 功能描述:8位微控制器 -MCU 7 KB Flash 256b RAM 32 MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1828T-I/ML | 功能描述:8位微控制器 -MCU 7 KB Flash 256B RAM 32 MHz Int Osc RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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