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| 型号： | PIC16LF1933-E/SP |
| 厂商： | Microchip Technology |
| 文件页数： | 12/40页 |
| 文件大小： | 0K |
| 描述： | MCU PIC 8BIT 4K FLASH 28SDIP |
| 标准包装： | 15 |
| 系列： | PIC® XLP™ 16F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 32MHz |
| 连通性： | I²C，LIN，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，LCD，POR，PWM，WDT |
| 输入/输出数： | 25 |
| 程序存储器容量： | 7KB（4K x 14） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 256 x 8 |
| RAM 容量： | 256 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.8 V ~ 3.6 V |
| 数据转换器： | A/D 11x10b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 28-DIP（0.300"，7.62mm） |
| 包装： | 管件 |
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PIC16F193X/LF193X
DS41360A-page 2
Advance Information
2008 Microchip Technology Inc.
Table of Contents
1.0
Overview ..................................................................................................................................................................................... 1
1.1
Hardware Requirements ......................................................................................................................................................... 1
1.1.1
High-Voltage ICSP Programming ................................................................................................................................ 1
1.1.2
Low-Voltage ICSP Programming ................................................................................................................................. 1
1.2
Pin Utilization .......................................................................................................................................................................... 1
2.0
Device Pinouts ............................................................................................................................................................................ 3
3.0
Memory Map ............................................................................................................................................................................... 8
3.1
User ID Location ..................................................................................................................................................................... 9
3.2
Device ID ................................................................................................................................................................................ 9
3.3
Configuration Words ............................................................................................................................................................. 10
3.4
Calibration Words ................................................................................................................................................................. 10
4.0
Program/Verify Mode ................................................................................................................................................................ 13
4.1
High Voltage Program/Verify Mode Entry and Exit ............................................................................................................... 13
4.1.1
VPP – First Entry Mode ............................................................................................................................................... 13
4.1.2
VDD – First Entry Mode .............................................................................................................................................. 13
4.1.3
Program/Verify Mode Exit .......................................................................................................................................... 13
4.2
Low-Voltage Programming (LVP) Mode ............................................................................................................................... 13
4.3
Program/Verify Commands ................................................................................................................................................... 14
4.3.1
Load Configuration ..................................................................................................................................................... 15
4.3.2
Load Data For Program Memory ............................................................................................................................... 15
4.3.3
Load Data For Data Memory ...................................................................................................................................... 16
4.3.4
Read Data From Program Memory ............................................................................................................................ 16
4.3.5
Read Data From Data Memory .................................................................................................................................. 17
4.3.6
Increment Address ..................................................................................................................................................... 17
4.3.7
Reset Address ............................................................................................................................................................ 18
4.3.8
Begin Internally Timed Programming ......................................................................................................................... 18
4.3.9
Begin Externally Timed Programming ........................................................................................................................ 19
4.3.10 End Externally Timed Programming .......................................................................................................................... 19
4.3.11 Bulk Erase Program Memory ..................................................................................................................................... 20
4.3.12 Bulk Erase Data Memory ........................................................................................................................................... 20
4.3.13 Row Erase Program Memory ..................................................................................................................................... 21
5.0
Programming Algorithms ........................................................................................................................................................... 22
6.0
Code Protection ......................................................................................................................................................................... 30
6.1
Program Memory .................................................................................................................................................................. 30
6.2
Data Memory ........................................................................................................................................................................ 30
7.0
Hex File Usage .......................................................................................................................................................................... 30
7.1
Configuration Word ............................................................................................................................................................... 30
7.2
Device ID and Revision ......................................................................................................................................................... 30
7.3
Data EEPROM ...................................................................................................................................................................... 30
7.4
Checksum Computation ........................................................................................................................................................ 31
7.4.1
Code Protection Disabled .......................................................................................................................................... 31
7.4.2
Code Protection Enabled ........................................................................................................................................... 32
8.0
Electrical Specifications............................................................................................................................................................. 33
8.1
AC Timing Diagrams ............................................................................................................................................................. 34
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PIC16LF1933-I/ML | 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1933-I/MV | 功能描述:8位微控制器 -MCU 7KB FL 256BRAM 256B EE LCD nanoWatt XLP RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1933-I/MV | 制造商:Microchip Technology Inc 功能描述:; Controller Family/Series:PIC16LF; Core |
| PIC16LF1933-I/SO | 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC16LF1933-I/SP | 功能描述:8位微控制器 -MCU 7KB Flash 1.8-5.5V 256B RAM 256B EEPROM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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