参数资料
型号: PIC16LF720T-I/SO
厂商: Microchip Technology
文件页数: 112/135页
文件大小: 0K
描述: MCU PIC 3.5KB FLASH 20SOIC
标准包装: 1,600
系列: PIC® XLP™ 16F
核心处理器: PIC
芯体尺寸: 8-位
速度: 16MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 17
程序存储器容量: 3.5KB(2K x 14)
程序存储器类型: 闪存
RAM 容量: 128 x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.6 V
数据转换器: A/D 12x8b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
包装: 带卷 (TR)
PIC16(L)F720/721
DS41430C-page 78
Preliminary
2010-2011 Microchip Technology Inc.
9.1
ADC Configuration
When configuring and using the ADC the following
functions must be considered:
Port configuration
Channel selection
ADC conversion clock source
Interrupt control
9.1.1
PORT CONFIGURATION
When converting analog signals, the I/O pin selected
as the input channel should be configured for analog by
setting the associated TRIS and ANSEL bits. Refer to
Section 6.0 “I/O Ports” for more information.
9.1.2
CHANNEL SELECTION
There are 14 channel selections available:
-AN<11:0> pins
- Temperature Indicator
- FVR (Fixed Voltage Reference) Output
more information on these channel selections.
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 9.2
“ADC Operation” for more information.
9.1.3
CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ADCON1 register.
There are seven possible clock options:
FOSC/2
FOSC/4
FOSC/8
FOSC/16
FOSC/32
FOSC/64
FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One full 8-bit conversion requires 10 TAD periods
as shown in Figure 9-2.
For
correct
conversion,
the
appropriate
TAD
specification must be met. Refer to the A/D conversion
requirements
in
Specifications” for more information. Table 9-1 gives
examples of appropriate ADC clock selections.
Note:
Analog voltages on any pin that is defined
as a digital input may cause the input buf-
fer to conduct excess current.
Note:
Unless using the FRC, any changes in the
system clock frequency will change the
ADC
clock
frequency,
which
may
adversely affect the ADC result.
TABLE 9-1:
ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
ADC Clock Period (TAD)
Device Frequency (FOSC)
ADC
Clock Source
ADCS<2:0>
16 MHz
8 MHz
4 MHz
1 MHz
FOSC/2
000
125 ns(2)
250 ns(2)
500 ns(2)
2.0
s
FOSC/4
100
250 ns(2)
500 ns(2)
1.0
s4.0 s
FOSC/8
001
0.5
s(2)
1.0
s2.0 s8 s(5)
FOSC/16
101
1.0
s2.0 s4.0 s16.0 s(5)
FOSC/32
010
2.0
s4.0 s8 s(5)
32.0
s(3)
FOSC/64
110
4.0
s8 s(5)
16.0
s(5)
64.0
s(3)
FRC
x11
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
1.0-6.0
s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1:
The FRC source has a typical TAD time of 1.6
s for VDD.
2:
These values violate the minimum required TAD time.
3:
For faster conversion times, the selection of another clock source is recommended.
4:
When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
5:
Recommended values for VDD
2.0V and temperature -40°C to 85°C. The 16.0 s setting should be
avoided for temperature > 85°C.
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