收藏本站
参数资料
型号： PIC18F2321-I/SS
厂商： Microchip Technology
文件页数： 31/110页
文件大小： 0K
描述： IC PIC MCU FLASH 4KX16 28SSOP
产品培训模块： Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
标准包装： 47
系列： PIC® 18F
核心处理器： PIC
芯体尺寸： 8-位
速度： 40MHz
连通性： I²C，SPI，UART/USART
外围设备： 欠压检测/复位，HLVD，POR，PWM，WDT
输入/输出数： 25
程序存储器容量： 8KB（4K x 16）
程序存储器类型： 闪存
EEPROM 大小： 256 x 8
RAM 容量： 512 x 8
电压 - 电源 (Vcc/Vdd)： 4.2 V ~ 5.5 V
数据转换器： A/D 10x10b
振荡器型： 内部
工作温度： -40°C ~ 85°C
封装/外壳： 28-SSOP（0.209"，5.30mm 宽）
包装： 管件
产品目录页面： 642 (CN2011-ZH PDF)
配用： AC164307-ND - MODULE SKT FOR PM3 28SSOP
2009 Microchip Technology Inc.
DS39689F-page 27
PIC18F2221/2321/4221/4321 FAMILY
2.4
ICSP Pins
The PGC and PGD pins are used for In-Circuit Serial
Programming (ICSP) and debugging purposes. It is
recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100.
Pull-up resistors, series diodes and capacitors on the
PGC and PGD pins are not recommended as they will
interfere
with
the
programmer/debugger
com-
munications to the device. If such discrete components
are an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (VIH)
and input low (VIL) requirements.
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGC/PGD pins) programmed
into the device matches the physical connections for
the ICSP to the MPLAB ICD 2, MPLAB ICD 3 or REAL
ICE emulator.
For more information on the ICD 2, ICD 3 and REAL
ICE emulator connection requirements, refer to the
following documents that are available on the
Microchip web site.
“MPLAB ICD 2 In-Circuit Debugger User’s
Guide” (DS51331)
“Using MPLAB ICD 2” (poster) (DS51265)
“MPLAB ICD 2 Design Advisory” (DS51566)
“Using MPLAB ICD 3” (poster) (DS51765)
“MPLAB ICD 3 Design Advisory” (DS51764)
“MPLAB REAL ICE In-Circuit Emulator User’s
Guide” (DS51616)
“Using MPLAB REAL ICE In-Circuit Emulator”
(poster) (DS51749)
2.5
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
secondary
oscillator
(refer
to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-3.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC and PICmicro Devices”
AN849, “Basic PICmicro Oscillator Design”
AN943, “Practical PICmicro Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
FIGURE 2-3:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
2.6
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
13
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
14
15
16
17
18
19
20
相关PDF资料
PDF描述
PIC18LF25J50-I/ML IC PIC MCU FLASH 32K 2V 28-QFN
PIC18F25J50-I/ML IC PIC MCU FLASH 32K 2V 28-QFN
PIC18F1230-I/SO IC PIC MCU FLASH 2KX16 18SOIC
PIC16C711-04/SO IC MCU OTP 1KX14 A/D 18SOIC
PIC16F628-20I/P IC MCU FLASH 2KX14 COMP 18DIP
相关代理商/技术参数
参数描述
PIC18F2321T-I/ML 功能描述:8位微控制器 -MCU 8 KB Flash 512 RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2321T-I/SO 功能描述:8位微控制器 -MCU 8 KB Flash 512 RAM RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2321T-I/SS 功能描述:8位微控制器 -MCU 8KB Flash 512bytes RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2331-E/ML 功能描述:8位微控制器 -MCU 8KB 768 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2331-E/MM 功能描述:8位微控制器 -MCU 8KB 768 RAM 22 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*