参数资料
型号: PIC18F25K22T-I/ML
厂商: Microchip Technology
文件页数: 66/71页
文件大小: 0K
描述: MCU 8BIT 32KB FLASH 28QFN
标准包装: 1,600
系列: PIC® XLP™ 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 64MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,HLVD,POR,PWM,WDT
输入/输出数: 24
程序存储器容量: 32KB(16K x 16)
程序存储器类型: 闪存
EEPROM 大小: 256 x 8
RAM 容量: 1.5K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 5.5 V
数据转换器: A/D 19x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 28-VQFN 裸露焊盘
包装: 带卷 (TR)
2010-2012 Microchip Technology Inc.
DS41412F-page 69
PIC18(L)F2X/4XK22
5.0
MEMORY ORGANIZATION
There are three types of memory in PIC18 Enhanced
microcontroller devices:
Program Memory
Data RAM
Data EEPROM
As Harvard architecture devices, the data and program
memories
use
separate
buses;
this
allows
for
concurrent access of the two memory spaces. The data
EEPROM, for practical purposes, can be regarded as
a peripheral device, since it is addressed and accessed
through a set of control registers.
Additional detailed information on the operation of the
Flash program memory is provided in Section 6.0
Data
EEPROM
is
discussed separately in Section 7.0 “Data EEPROM
5.1
Program Memory Organization
PIC18 microcontrollers implement a 21-bit program
counter, which is capable of addressing a 2-Mbyte
program memory space. Accessing a location between
the upper boundary of the physically implemented
memory and the 2-Mbyte address will return all ‘0’s (a
NOP
instruction).
This family of devices contain the following:
PIC18(L)F23K22, PIC18(L)F43K22: 8 Kbytes of
Flash Memory, up to 4,096 single-word instructions
PIC18(L)F24K22, PIC18(L)F44K22: 16 Kbytes of
Flash Memory, up to 8,192 single-word instructions
PIC18(L)F25K22, PIC18(L)F45K22: 32 Kbytes of
Flash Memory, up to 16,384 single-word instruc-
tions
PIC18(L)F26K22, PIC18(L)F46K22: 64 Kbytes of
Flash Memory, up to 37,768 single-word
instructions
PIC18 devices have two interrupt vectors. The Reset
vector address is at 0000h and the interrupt vector
addresses are at 0008h and 0018h.
The program memory map for PIC18(L)F2X/4XK22
devices is shown in Figure 5-1. Memory block details
are shown in Figure 20-2.
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