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| 型号： | PIC18F2685-E/SO |
| 厂商： | Microchip Technology |
| 文件页数： | 108/183页 |
| 文件大小： | 0K |
| 描述： | IC PIC MCU FLASH 48KX16 28SOIC |
| 产品培训模块： | Asynchronous Stimulus |
| 标准包装： | 27 |
| 系列： | PIC® 18F |
| 核心处理器： | PIC |
| 芯体尺寸： | 8-位 |
| 速度： | 40MHz |
| 连通性： | CAN，I²C，SPI，UART/USART |
| 外围设备： | 欠压检测/复位，HLVD，POR，PWM，WDT |
| 输入/输出数： | 25 |
| 程序存储器容量： | 96KB（48K x 16） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 1K x 8 |
| RAM 容量： | 3.25K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4.2 V ~ 5.5 V |
| 数据转换器： | A/D 8x10b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 包装： | 管件 |
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PIC18F46J50 FAMILY
DS39931D-page 30
2011 Microchip Technology Inc.
2.2
Power Supply Pins
2.2.1
DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS, is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: A 0.1
F (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device, with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01
F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1
F in parallel with 0.001 F).
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
2.2.2
BULK CAPACITORS
On boards with power traces running longer than
six inches in length, it is suggested to use a larger
energy storing capacitor for integrated circuits, includ-
ing microcontrollers, to supply a local power source.
The value of this capacitor should be determined based
on the trace resistance that connects the power supply
source to the device, and the maximum current drawn
by the device in the application. In other words, select
the capacitor so that it meets the acceptable voltage
sag at the device. Typical values range from 4.7
F to
47
F.
2.3
Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: Device Reset, and Device Programming
and Debugging. If programming and debugging are
not required in the end application, a direct
connection to VDD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage
sags,
may
be
beneficial.
A
typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented, depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR pin. Consequently, specific voltage
levels (VIH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR pin during programming and
debugging operations by using a jumper (Figure 2-2).
The
jumper
is
replaced
for
normal
run-time
operations.
Any components associated with the MCLR pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2:
EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1:
R1
10 k is recommended. A suggested
starting value is 10 k
. Ensure that the
MCLR pin VIH and VIL specifications are met.
2:
R2
470 will limit any current flowing into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
VIH and VIL specifications are met.
C1
R2
R1
VDD
MCLR
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| PIC18F2685-I/SO | 功能描述:8位微控制器 -MCU 96KB 3328bytes-RAM 25I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F2685-I/SO | 制造商:Microchip Technology Inc 功能描述:8-Bit Microcontroller IC |
| PIC18F2685-I/SP | 功能描述:8位微控制器 -MCU 96KB 3328bytes-RAM 25I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F2685T-I/SO | 功能描述:8位微控制器 -MCU 96KB 3328bytes-RAM 25I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
| PIC18F26J11-I/ML | 功能描述:8位微控制器 -MCU 64KB Flash 4KBRAM 12MIPS nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT |
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