参数资料
型号: PIC18F4410-E/P
厂商: Microchip Technology
文件页数: 204/234页
文件大小: 0K
描述: IC MCU FLASH 8KX16 40DIP
产品培训模块: Asynchronous Stimulus
标准包装: 10
系列: PIC® 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 25MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,HLVD,POR,PWM,WDT
输入/输出数: 36
程序存储器容量: 16KB(8K x 16)
程序存储器类型: 闪存
RAM 容量: 768 x 8
电压 - 电源 (Vcc/Vdd): 4.2 V ~ 5.5 V
数据转换器: A/D 13x10b
振荡器型: 内部
工作温度: -40°C ~ 125°C
封装/外壳: 40-DIP(0.600",15.24mm)
包装: 管件
配用: DVA18XP400-ND - DEVICE ADAPTER 18F4220 PDIP 40LD
ACICE0206-ND - ADAPTER MPLABICE 40P 600 MIL
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2009 Microchip Technology Inc.
DS39636D-page 73
PIC18F2X1X/4X1X
The PLUSW register can be used to implement a form
of indexed addressing in the data memory space. By
manipulating the value in the W register, users can
reach addresses that are fixed offsets from pointer
addresses. In some applications, this can be used to
implement some powerful program control structure,
such as software stacks, inside of data memory.
5.4.3.3
Operations by FSRs on FSRs
Indirect addressing operations that target other FSRs
or virtual registers represent special cases. For exam-
ple, using an FSR to point to one of the virtual registers
will not result in successful operations. As a specific
case, assume that FSR0H:FSR0L contains FE7h, the
address of INDF1. Attempts to read the value of the
INDF1 using INDF0 as an operand will return 00h.
Attempts to write to INDF1 using INDF0 as the operand
will result in a NOP.
On the other hand, using the virtual registers to write to
an FSR pair may not occur as planned. In these cases,
the value will be written to the FSR pair but without any
incrementing or decrementing. Thus, writing to INDF2
or POSTDEC2 will write the same value to the
FSR2H:FSR2L.
Since the FSRs are physical registers mapped in the
SFR space, they can be manipulated through all direct
operations. Users should proceed cautiously when
working on these registers, particularly if their code
uses indirect addressing.
Similarly, operations by indirect addressing are gener-
ally permitted on all other SFRs. Users should exercise
the appropriate caution that they do not inadvertently
change settings that might affect the operation of the
device.
5.5
Data Memory and the Extended
Instruction Set
Enabling the PIC18 extended instruction set (XINST
Configuration bit = 1) significantly changes certain
aspects of data memory and its addressing. Specifi-
cally, the use of the Access Bank for many of the core
PIC18 instructions is different; this is due to the
introduction of a new addressing mode for the data
memory space.
What does not change is just as important. The size of
the data memory space is unchanged, as well as its
linear addressing. The SFR map remains the same.
Core PIC18 instructions can still operate in both Direct
and Indirect Addressing mode; inherent and literal
instructions do not change at all. Indirect addressing
with FSR0 and FSR1 also remain unchanged.
5.5.1
INDEXED ADDRESSING WITH
LITERAL OFFSET
Enabling the PIC18 extended instruction set changes
the behavior of indirect addressing using the FSR2
register pair within access RAM. Under the proper
conditions, instructions that use the Access Bank – that
is, most bit-oriented and byte-oriented instructions –
can invoke a form of indexed addressing using an
offset specified in the instruction. This special address-
ing mode is known as Indexed Addressing with Literal
Offset, or Indexed Literal Offset mode.
When using the extended instruction set, this
addressing mode requires the following:
The use of the Access Bank is forced (‘a’ = 0);
and
The file address argument is less than or equal to
5Fh.
Under these conditions, the file address of the instruc-
tion is not interpreted as the lower byte of an address
(used with the BSR in direct addressing), or as an 8-bit
address in the Access Bank. Instead, the value is
interpreted as an offset value to an Address Pointer,
specified by FSR2. The offset and the contents of
FSR2 are added to obtain the target address of the
operation.
5.5.2
INSTRUCTIONS AFFECTED BY
INDEXED LITERAL OFFSET MODE
Any of the core PIC18 instructions that can use direct
addressing are potentially affected by the Indexed Literal
Offset Addressing mode. This includes all byte-oriented
and bit-oriented instructions, or almost one-half of the
standard PIC18 instruction set. Instructions that only use
Inherent or Literal Addressing modes are unaffected.
Additionally, byte-oriented and bit-oriented instructions
are not affected if they do not use the Access Bank
(Access RAM bit is ‘1’), or include a file address of 60h
or above. Instructions meeting these criteria will
continue to execute as before. A comparison of the
different possible addressing modes when the
extended instruction set is enabled is shown in
Those who desire to use bit-oriented or byte-oriented
instructions in the Indexed Literal Offset mode should
note the changes to assembler syntax for this mode.
This is described in more detail in Section 23.2.1
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PIC18F4410-I/ML 功能描述:8位微控制器 -MCU 16KB 768 RAM 36I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4410-I/P 功能描述:8位微控制器 -MCU 16KB 768 RAM 36I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4410-I/PT 功能描述:8位微控制器 -MCU 16KB 768 RAM 36I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4410T-I/ML 功能描述:8位微控制器 -MCU 16KB 768 RAM 36I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4410T-I/PT 功能描述:8位微控制器 -MCU 16KB 768 RAM 36I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT