参数资料
型号: PIC18F66K90T-I/PT
厂商: Microchip Technology
文件页数: 67/110页
文件大小: 0K
描述: IC MCU 8BIT 64KB FLASH 64TQFP
标准包装: 1,200
系列: PIC® XLP™ 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 64MHz
连通性: I²C,LIN,SPI,UART/USART
外围设备: 欠压检测/复位,LCD,POR,PWM,WDT
输入/输出数: 53
程序存储器容量: 64KB(32K x 16)
程序存储器类型: 闪存
EEPROM 大小: 1K x 8
RAM 容量: 4K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 5.5 V
数据转换器: A/D 16x12b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 64-TQFP
包装: 带卷 (TR)
2010 Microchip Technology Inc.
Preliminary
DS39964B-page 513
PIC18F47J53 FAMILY
31.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings()
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any digital only I/O pin or MCLR with respect to VSS (except VDD) ........................................... -0.3V to 6.0V
Voltage on any combined digital and analog pin with respect to VSS (except VDD)........................ -0.3V to (VDD + 0.3V)
Voltage on VDDCORE with respect to VSS................................................................................................... -0.3V to 2.75V
Voltage on VDD with respect to VSS ........................................................................................................... -0.3V to 4.0V
Voltage on VUSB with respect to VSS................................................................................................ (VDD – 0.3V) to 4.0V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Maximum output current sunk by any PORTB, PORTC and RA6 I/O pin...............................................................25mA
Maximum output current sunk by any PORTA (except RA6), PORTD and PORTE I/O pin......................................8 mA
Maximum output current sourced by any PORTB, PORTC and RA6 I/O pin .........................................................25 mA
Maximum output current sourced by any PORTA (except RA6), PORTD and PORTE I/O pin ................................8 mA
Maximum current sunk by
all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
Note 1: Power dissipation is calculated as follows:
PDIS = VDD x {IDD
IOH} + {(VDD – VOH) x IOH} + (VOL x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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