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参数资料
型号： PIC18LF452-I/L
厂商： Microchip Technology
文件页数： 91/134页
文件大小： 0K
描述： IC MCU FLASH 16KX16 A/D 44PLCC
产品培训模块： Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
标准包装： 27
系列： PIC® 18F
核心处理器： PIC
芯体尺寸： 8-位
速度： 40MHz
连通性： I²C，SPI，UART/USART
外围设备： 欠压检测/复位，LVD，POR，PWM，WDT
输入/输出数： 34
程序存储器容量： 32KB（16K x 16）
程序存储器类型： 闪存
EEPROM 大小： 256 x 8
RAM 容量： 1.5K x 8
电压 - 电源 (Vcc/Vdd)： 2 V ~ 5.5 V
数据转换器： A/D 8x10b
振荡器型： 外部
工作温度： -40°C ~ 85°C
封装/外壳： 44-LCC（J 形引线）
包装： 管件
PIC18FXX2
DS39564C-page 4
2006 Microchip Technology Inc.
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 7
2.0
Oscillator Configurations ............................................................................................................................................................ 17
3.0
Reset .......................................................................................................................................................................................... 25
4.0
Memory Organization ................................................................................................................................................................. 35
5.0
FLASH Program Memory ........................................................................................................................................................... 55
6.0
Data EEPROM Memory ............................................................................................................................................................. 65
7.0
8 X 8 Hardware Multiplier ........................................................................................................................................................... 71
8.0
Interrupts .................................................................................................................................................................................... 73
9.0
I/O Ports ..................................................................................................................................................................................... 87
10.0 Timer0 Module ......................................................................................................................................................................... 103
11.0 Timer1 Module ......................................................................................................................................................................... 107
12.0 Timer2 Module ......................................................................................................................................................................... 111
13.0 Timer3 Module ......................................................................................................................................................................... 113
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 117
15.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 125
16.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 165
17.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module................................................................................................... 181
18.0 Low Voltage Detect .................................................................................................................................................................. 189
19.0 Special Features of the CPU .................................................................................................................................................... 195
20.0 Instruction Set Summary .......................................................................................................................................................... 211
21.0 Development Support............................................................................................................................................................... 253
22.0 Electrical Characteristics .......................................................................................................................................................... 259
23.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 289
24.0 Packaging Information.............................................................................................................................................................. 305
Appendix A: Revision History ............................................................................................................................................................ 313
Appendix B: Device Differences........................................................................................................................................................ 313
Appendix C: Conversion Considerations........................................................................................................................................... 314
Appendix D: Migration from Baseline to Enhanced Devices ............................................................................................................. 314
Appendix E: Migration from Mid-range to Enhanced Devices........................................................................................................... 315
Appendix F: Migration from High-end to Enhanced Devices ............................................................................................................ 315
Index .................................................................................................................................................................................................. 317
On-Line Support................................................................................................................................................................................. 327
Reader Response .............................................................................................................................................................................. 328
PIC18FXX2 Product Identification System......................................................................................................................................... 329
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PIC18LF452T-I/L 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18LF452T-I/ML 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18LF452T-I/PT 功能描述:8位微控制器 -MCU 32KB 1536 RAM 34I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18LF4539-I/ML 功能描述:8位微控制器 -MCU 24KB 1408 RAM 32I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18LF4539-I/P 功能描述:8位微控制器 -MCU 24KB 1408 RAM 32I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
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