参数资料
型号: PIC18LF8622T-I/PT
厂商: Microchip Technology
文件页数: 5/10页
文件大小: 0K
描述: IC PIC MCU FLASH 32KX16 80TQFP
产品培训模块: Asynchronous Stimulus
标准包装: 1,200
系列: PIC® 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 40MHz
连通性: EBI/EMI,I²C,SPI,UART/USART
外围设备: 欠压检测/复位,HLVD,POR,PWM,WDT
输入/输出数: 70
程序存储器容量: 64KB(32K x 16)
程序存储器类型: 闪存
EEPROM 大小: 1K x 8
RAM 容量: 3936 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 5.5 V
数据转换器: A/D 16x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 80-TQFP
包装: 带卷 (TR)
PIC18F6527/6622/8527/8622
DS80253B-page 4
2006 Microchip Technology Inc.
14. Module: MSSP (SPI Mode)
In SPI mode, the Buffer Full Status bit, BF
(SSPxSTAT<0>), should not be polled in software
to determine when the transfer is complete.
Work around
Copy the SSPxSTAT register into a variable and
perform the bit test on the variable. In Example 1,
SSPxSTAT is copied into the working register
where the bit test is performed (SSP1STAT is
shown, but this process is also applicable to
SSP2STAT).
EXAMPLE 1:
A second option is to poll the appropriate Master
Synchronous
Serial
Port
Interrupt
Flag
bit,
SSPxIF. This bit can be polled and will set when
the transfer is complete.
Date Codes that pertain to this issue:
All engineering and production devices.
15. Module: MSSP (SPI Mode)
In SPI Master mode, a write collision may occur if
the SSPxBUF register is loaded immediately after
a transfer is complete. This may be caused by an
inadequate delay between the MSSP Interrupt
Flag bit (SSPxIF) or the Buffer Full bit (BF) being
set, and SSPxBUF being written to.
This has only been observed when the SPI clock
is
operating
at
FOSC/64
or
((Timer2)/2)
(SSPxCON1<3:0> = 001x).
Work around
Add a software delay of one SCKx period after
detecting the completed transfer, and prior to
updating the contents of SSPxBUF.
Also verify that the Write Collision bit (WCOL) is
clear after writing SSPxBUF. If WCOL is set, clear
the bit in software and rewrite the contents of
SSPxBUF.
Date Codes that pertain to this issue:
All engineering and production devices.
16. Module: MSSP (I2C Mode)
In its current implementation, the I2C Master mode
operates as follows:
a)
The Baud Rate Generator for I2C in Master
mode is slower than the rates specified in
Table 17-3 of the Device Data Sheet.
For this revision of silicon, use the values
shown in Table 2 (below) in place of those
shown in Table 17-3 of the Device Data Sheet.
The differences are shown in bold text.
b)
Use the following formula in place of the
one shown in Register 19-4 (SSPxCON1)
of the Device Data Sheet for bit description
SSPM3:SSPM0 = 1000.
SSPxADD = INT((FCY/FSCL) – (FCY/1.111 MHz)) – 1
Date Codes that pertain to this issue:
All engineering and production devices.
TABLE 2:
I2C CLOCK RATE w/BRG
loop_MSB:
MOVF
SSP1STAT, W
BTFSS
WREG, BF
BRA
loop_MSB
FOSC
FCY
FCY * 2
BRG Value
FSCL
(2 Rollovers of BRG)
40 MHz
10 MHz
20 MHz
0Eh
400 kHz(1)
40 MHz
10 MHz
20 MHz
15h
312.5 kHz
40 MHz
10 MHz
20 MHz
59h
100 kHz
16 MHz
4 MHz
8 MHz
05h
400 kHz(1)
16 MHz
4 MHz
8 MHz
08h
308 kHz
16 MHz
4 MHz
8 MHz
23h
100 kHz
4 MHz
1 MHz
2 MHz
01h
333 kHz(1)
4 MHz
1 MHz
2 MHz
08h
100 kHz
4 MHz
1 MHz
2 MHz
00h
1 MHz(1)
Note 1:
The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
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