参数资料
型号: CU3225K11G2
厂商: EPCOS Inc
文件页数: 20/35页
文件大小: 0K
描述: VARISTOR STD 11VRMS 3225 SMD
产品目录绘图: CU3225K Series_Max V Allowance 11~175 Side1
CU3225K Series_Max V Allowance 11~175 Side2
标准包装: 2,000
系列: CU
变阻器电压: 18V
电流 - 浪涌: 100A
电路数: 1
最大交流电压: 11VAC
最大直流电压: 14VDC
能量: 0.30J
封装/外壳: 3225(8063 公制)
其它名称: B72650M 110K 72
B72650M0110K072
B72650M110K72
SMD disk varistors (CU varistors)
Standard series
Soldering directions
1
1.1
Terminations
Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-
allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-
vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-
rier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination
1.2
Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-
tended for conductive adhesion. This metallization improves the resistance of large chips to ther-
mal shock.
In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-
sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-
cations as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 35
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