参数资料
| 型号： | CU3225K11G2 |
| 厂商： | EPCOS Inc |
| 文件页数： | 33/35页 |
| 文件大小： | 0K |
| 描述： | VARISTOR STD 11VRMS 3225 SMD |
| 产品目录绘图： | CU3225K Series_Max V Allowance 11~175 Side1 CU3225K Series_Max V Allowance 11~175 Side2 |
| 标准包装： | 2,000 |
| 系列： | CU |
| 变阻器电压： | 18V |
| 电流 - 浪涌： | 100A |
| 电路数： | 1 |
| 最大交流电压： | 11VAC |
| 最大直流电压： | 14VDC |
| 能量： | 0.30J |
| 封装/外壳： | 3225（8063 公制） |
| 其它名称： | B72650M 110K 72 B72650M0110K072 B72650M110K72 |
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SMD disk varistors (CU varistors)
Standard series
Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures like
thermal fuses.
Storage
Only store CTVS in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature
25 to +45 ° C, relative humidity ≤ 75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.
Avoid contamination of the CTVS surface during storage, handling and processing.
Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SO x , Cl).
Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CTVS components after shipment from EPCOS within the time specified:
CTVS with Ni barrier termination, 12 months
CTVS with AgPd and AgPt termination, 6 months
SHCV and CU series, 24 months
Handling
Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Mounting
When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, electrical characteristics might be degraded and the life time reduced.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.
Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 33 of 35
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