参数资料
型号: PK20X256VMD100
厂商: Freescale Semiconductor
文件页数: 16/75页
文件大小: 0K
描述: IC ARM CORTEX MCU 256K 144-MAP
产品培训模块: Kinetis® Cortex-M4 Microcontroller Family
标准包装: 1
系列: Kinetis
核心处理器: ARM? Cortex?-M4
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,IrDA,SDHC,SPI,UART/USART,USB,USB OTG
外围设备: DMA,I²S,LVD,POR,PWM,WDT
输入/输出数: 100
程序存储器容量: 256KB(256K x 8)
程序存储器类型: 闪存
EEPROM 大小: 4K x 8
RAM 容量: 64K x 8
电压 - 电源 (Vcc/Vdd): 1.71 V ~ 3.6 V
数据转换器: A/D 33x16b,D/A 2x12b
振荡器型: 内部
工作温度: -40°C ~ 105°C
封装/外壳: 144-LBGA
包装: 托盘
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
Description
Min.
Max.
Unit
TJ
Die junction temperature
–40
125
°C
TA
Ambient temperature
–40
105
°C
5.4.2 Thermal attributes
Board type
Symbol
Description
144 LQFP
144
MAPBGA
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
45
48
°C/W
Four-layer
(2s2p)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
36
29
°C/W
Single-layer
(1s)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
36
38
°C/W
Four-layer
(2s2p)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
30
25
°C/W
RθJB
Thermal
resistance,
junction to
board
24
16
°C/W
RθJC
Thermal
resistance,
junction to case
9
°C/W
ΨJT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2
°C/W
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
General
K20 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Freescale Semiconductor, Inc.
23
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