Ericsson Internal
PRODUCT SPECIFICATION
2 (4)
Prepared (also subject responsible if other)
No.
EAB/FC/P Maria Rosendahl
1/1301-BMR658
Approved
Checked
Date
Rev
Reference
EAB/FJB/GKF (Natalie Johansson)
MICTOJO
2008-06-03
B
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option
Suffix
Ordering No.
Surface mount
Positive Remote Control Logic
Lead length 3.69 mm (0.145 in)
Lead length 4.57 mm (0.180 in)
Increased stand-off height
Baseplate
SI
P
LA
LB
M
HS
PKB 4204B SI
PKB 4204B PIP
PKB 4204B PILA
PKB 4204B PILB
PKB 4204B PIM
PKB 4204B PIHS
Note 1: As an example a positive logic, short pin product with baseplate
would be PKB 4204 PIPHSLA.
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
A) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
-
1.3 million hours according to Telcordia SR332, issue
1, Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
-
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
General Terms and Conditions of Sale.
Limitation of Liability
Ericsson does not make any other warranties, expressed or
implied including any warranty of merchantability or fitness
for a particular purpose (including, but not limited to, use in
life support applications, where malfunctions of product
can cause injury to a person’s health or life).
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
Ericsson Power Modules AB
Technical Specification
2