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参数资料
| 型号： | PKB4204BPIM |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 2-OUTPUT 194 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, PACKAGE-5 |
| 文件页数： | 10/20页 |
| 文件大小： | 1256K |
| 代理商： | PKB4204BPIM |
Ericsson Confidential
PRODUCT SPEC.
1 (4)
Prepared (also subject responsible if other)
No.
EXXUYNG
5/1301- BMR 658 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Betty Wu)
See §1
2008-11-27
B
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb and Pb-free
processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN) in excess
of the solder melting temperature, (T
L, 183°C for Sn63Pb37)
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of
solder paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment (dry
pack handling and storage) prior to assembly.
General reflow process specifications
SnPb eutectic
Pb-free
Average ramp-up (T
PRODUCT)
3°C/s max
Typical solder melting (liquidus)
temperature
T
L
183°C
221°C
Minimum reflow time above T
L
30 s
Minimum pin temperature
T
PIN
210°C
235°C
Peak product temperature
T
PRODUCT
225°C
260°C
Average ramp-down (T
PRODUCT)
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
T
PRODUCT maximum
T
PIN minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Thermocouple Attachment
Pin 4 for measurement of minimum pin (solder
joint) temperature, TPIN
Top of PCB near pin 2 for measurement of
maximum product temperature, TPRODUCT
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
Ericsson Power Modules AB
Technical Specification
18
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