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参数资料
| 型号： | PKB4910ASIP |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 108.9 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT PACKAGE-7 |
| 文件页数： | 11/21页 |
| 文件大小： | 1285K |
| 代理商： | PKB4910ASIP |
Ericsson Internal
PROD. SPECIFICATION MECHANICAL
1 (4)
Prepared (also subject responsible if other)
No.
EPETSCH
5/1301-BMR 662 Uen
Approved
Checked
Date
Rev
Reference
EAB/FJB/GM [Natalie J]
See §1
2010-01-18
A
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb and Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
reflow profiling techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendations since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN) in excess
of the solder melting temperature, (T
L, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221°C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Peak Product Temperature Requirements
Pin number 2 is chosen as reference location for the
maximum (peak) allowed product temperature (T
P) since this
will likely be the warmest part of the product during the reflow
process.
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. A sufficiently extended preheat time is recommended
to ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +225°C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +260°C at any time.
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Reflow process specifications
Sn/Pb eutectic
Pb-free
Average ramp-up rate
3°C/s max
Solder melting
temperature (typical)
T
L
+183°C
+221°C
Minimum time above T
L
30 s
Minimum pin temperature
T
PIN
+210°C
+235°C
Peak product temperature T
P
+225°C
+260°C
Average ramp-down rate
6°C/s max
Time 25°C to peak
6 minutes max
8 minutes max
Pin 2 for measurement of maximum
Peak product reflow temperature, T
PIN
Pin 4 for measurement of minimum
Solder joint temperature, T
PIN
E
PKB 4000A series
Direct Converters
Input 38-72 V, Output up to 30 A / 125 W
EN/LZT 146 420 R2A May 2010
Ericsson AB
Technical Specication
19
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