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参数资料
| 型号： | PKD4510ESI |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, SMD-24 |
| 文件页数： | 15/24页 |
| 文件大小： | 811K |
| 代理商： | PKD4510ESI |
Ericsson Internal
PROD. SPECIFICATION MECHANICAL
2 (5)
Prepared (also subject responsible if other)
No.
MICKAOV
5/1301-BMR 628 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Julia You)
See §1
2007-10-08
B
Pin Temperature Recommendations
Pin number 6/7 and 18/19 are chosen as reference locations
for the minimum pin (solder joint) temperature
recommendations since these will likely be the coolest solder
joints during reflow
SnPb Solder Processes
Minimum pin temperature: for SnPb solder processes, a pin
temperature (T
PIN) in excess of the solder melting temperature,
(T
L, +183°C for Sn63Pb37) for more than 30 seconds, and a
peak temperature of +210°C is recommended to ensure a
reliable solder joint.
A maximum pin temperature of +225°C should be sufficient
for most applications but depending on type of solder paste
and flux system used on the host board, up to a
recommended maximum temperature of +245°C could be
used, provided that the products are kept in a controlled
environment (dry pack handling and storage) prior to
assembly.
Pb-free Solder Processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221 °C
for SnAgCu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 1 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT), since this will likely be the warmest part of the
product during the reflow process.
SnPb Solder Processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C (no dry pack handling or controlled environment
required)
During reflow, T
PRODUCT must not exceed +225 °C at any time.
If the products are handled as MSL 3 products, they can
withstand up to +260°C as in Pb-free solder processes.
Pb-free Solder Processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
PRODUCT must not exceed +260 °C at any time.
Surface Mount Assembly and Repair
The solder bumps of the product require particular care
during assembly since the solder bumps are hidden between
the host board and the product’s PCB. Special procedures
are required for successful rework of these products.
Assembly
Automatic pick and place equipment should be used to
mount the product on the host board. The use of a vision
system, utilizing the fiducials on the bottom side of the
product, will ensure adequate accuracy. Manual mounting of
solder bump products is not recommended.
Note that the actual position of the pick up surface may vary
between variants within the product program and is not
necessarily in the center of the product outline.
If necessary, it is recommended to fine tune the solder print
aperture size to optimize the amount of deposited solder with
consideration to screen thickness and solder print capability.
Repair
For a successful repair (removal and replacement) of a solder
bump product, a dedicated rework system should be used.
The rework system should preferably utilize a bottom side
heater and a dedicated hot air nozzle to heat the solder
bumps to reflow temperature.
The product is an open frame design with a pick up surface
on a large central component. This pick up surface can not be
used for removal with a vacuum nozzle since the component
solder joints may have melted during the removal reflow.
In order not to damage the product and nearby components
during removal and replacement with a new product, it is
recommended to use a double wall design of the hot air
nozzle to direct the air flow only to the edges of the product,
see ‘Assembly Information’ in the mechanical drawing.
E
PKD 4000E SI series
DC/DC converters, Input 36-75 V, Output up to 20 A/50 W
EN/LZT 146 375 R2B July 2008
Ericsson Power Modules AB
22
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