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PKG 2000 I Series Datasheet EN/LZT 146 03 R3A Ericsson Power Modules, April 2007
Quality Statement
The products are designed and manufactured in an industrial en-
vironment where quality systems and methods like ISO 9000, 6
σ
and SPC, are intensively in use to boost the continuous improve-
ments strategy. Infant mortality or early failures in the products are
screened out by a burn-in procedure and an ATE-based final test.
Conservative design rules, design reviews and product qualifica-
tions, as well as high competence of an engaged work force, con-
tribute to the high quality of our products.
Reliability
Meantime between failure (MTBF) is calculated to >1.7 million hours
at full output power and a case temperature of +75°C (TA =+40 °C),
using the Ericsson failure rate data system. The Ericsson failure
rate data system is based on field failure rates and is continously
updated. The data corresponds to actual failure rates of conponent
used in Information Technology and Telecom equipment in tempera-
ture contledenvironments (TA =–5…+65°C). The data is considered
to have a confidence level of 90%. For more information see Design
Note 002.
Warranty
Warranty period and conditions are defined in Ericsson Power Mod-
ules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other warranties,
expressed or implied including any warranty of merchantability
or fitness for a particular purpose (including, but not limited to,
use in life support applications, where malfunctions of product
can cause injury to a person's health or life).
Compatibility with RoHS requirements
TThe products are compatible with the relevant clauses and require-
ments of the RoHS directive 2002/95/EC and have a maximum con-
centration value of 0.1% by weight in homogeneous materials for
lead, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by
weight in homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in the products:
- Lead in high melting temperature type solder (used to solder the die
in semiconductor packages)
- Lead in glass of electronics components and in electronic ceramic
parts (e.g. fill material in chip resistors)
- Lead as an alloying element in copper alloy containing up to 4%
lead by weight (used in connection pins made of Brass)
Quality