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PKG4000ISeriesDatasheetEN/LZT14604R3AEricssonPowerModules,April2007
QualityStatement
The products are designed and manufactured in an industrial
environment where quality systems and methods like ISO
9000, 6
σ and SPC, are intensively in use to boost the contin-
uous improvements strategy. Infant mortality or early failures
in the products are screened out by a burn-in procedure and
an ATE-based final test. Conservative design rules, design
reviews and product qualifications, as well as high compe-
tence of an engaged work force, contribute to the high qual-
ity of our products.
Reliability
Meantime between failure (MTBF) is calculated to >1.7 mil-
lion hours at full output power and a case temperature of
+75°C (TA =+40 °C), using the Ericsson failure rate data
system. The Ericsson failure rate data system is based on
field failure rates and is continously updated. The data cor-
responds to actual failure rates of conponent used in Infor-
mation Technology and Telecom equipment in temperature
contledenvironments (TA =–5…+65°C). The data is consid-
ered to have a confidence level of 90%. For more informa-
tion see Design Note 002.
Quality
Warranty
Warranty period and conditions are defined in Ericsson Pow-
er Modules General Terms and Conditions of Sale.
LimitationofLiability
Ericsson Power Modules does not make any other warran-
ties, expressed or implied including any warranty of mer-
chantability or fitness for a particular purpose (including, but
not limited to, use in life support applications, where mal-
functions of product can cause injury to a person's health or
life).
CompatibilitywithRoHSrequirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in homoge-
neous materials for lead, mercury, hexavalent chromium, PBB
and PBDE and of 0.01% by weight in homogeneous materials
for cadmium.
Exemptions in the RoHS directive utilized in Ericsson Power
Modules products include:
- Lead in high melting temperature type solder (used to sol
der the die in semiconductor packages)
- Lead in glass of electronics components and in electronic
ceramic parts (e.g. fill material in chip resistors)
- Lead as an alloying element in copper alloy containing up
to 4% lead by weight (used in connection pins made of
Brass)