- 您现在的位置：买卖IC网 > PDF目录69057 > PKR2221ASPBI (ERICSSON POWER MODULES AB) 2-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE PDF资料下载
参数资料
| 型号： | PKR2221ASPBI |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 2-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | SMD-18 |
| 文件页数： | 17/27页 |
| 文件大小： | 794K |
| 代理商： | PKR2221ASPBI |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页当前第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页
Ericsson Internal
PROD. SPECIFICATION MECHANICAL
1 (5)
Prepared (also subject responsible if other)
No.
MICKAOV
5/1301-BMR 6401 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Julia You)
See §1
2007-10-08
D
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection reflow or vapor phase reflow in SnPb or Pb-free
reflow processes.
Mounting Options
The surface mount version is available in two options, SnPb
based or SnAgCu based (Pb-free) solder bumps.
The SnPb solder bumps are intended for SnPb solder paste
on the host board and to be reflowed in SnPb reflow process
temperatures, typically +210 to +220°C.
The Pb-free solder bumps are intended for Pb-free solder
paste on the host board and to be reflowed in Pb-free reflow
process temperatures, typically +235 to +250°C.
Note that recommendations for minimum and maximum pin
temperature — and maximum peak product temperature — are
different depending on mounting option, reflow process type
and if the dry packing of the products has been kept intact.
General Reflow Profile Recommendations
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and to minimize the time in
reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Reflow process specifications
1
SnPb eutectic
Pb-free
Average ramp-up rate
3°C/s max
Typical solder melting (liquidus)
temperature
T
L
+183°C
+221°C
Minimum reflow time above T
L
30 s
Minimum pin temperature
T
PIN
+210°C
+235°C
Peak product temperature
T
PRODUCT
+225°C
+260°C
Average ramp-down rate
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
1 Note: for mixed SnPb / Pb-free soldering, special recommendations apply
T
PRODUCT maximum
T
PIN minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Mixed Solder Process Recommendations
When using products with Pb-free solder bumps and thereby
mixing Pb-free solder with SnPb paste on the host board and
reflowing at SnPb process temperatures (backwards
compatibility), special recommendations apply.
An extended preheat time between +170°C and +180°C for
60 to 90s and a pin reflow temperature (T
PIN) between +220°C
and +225°C for 30 to 60 s is recommended.
The extended preheat and soak at reflow temperature will
minimize temperature gradients and maximize the wetting
and solder mixing in the final solder joints. The use of nitrogen
reflow atmosphere will further improve the solder joint quality.
30-60 s
221°C to 225°C
60-90 s
170°C to 180°C
Solder bump
Profile
Temperature
Time
Dry Pack Information
Products intended for Pb-free reflow processes are delivered
in standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices). The SnPb
option of this product is also delivered in dry packing.
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Thermocoupler Attachment
Top of PCB near pin
9 or pin 10 for
measurement of
maximum product
temperature, TPRODUCT
Pin 5 of pin 14 for measurement of minimum
pin (solder joint) temperature, TPIN
E
PKR 2000A series
DC/DC converters, Input 18-36 V, Output up to 2 A/15 W
EN/LZT 146 352 R2C September 2007
Ericsson Power Modules AB
Technical Specication
24
相关PDF资料 |
PDF描述 |
|---|---|
| PKR2113ASI | 1-OUTPUT 12 W DC-DC REG PWR SUPPLY MODULE |
| PKR4110BSPBI | 1-OUTPUT 15 W DC-DC REG PWR SUPPLY MODULE |
| PKR4128BSPBI | 1-OUTPUT 12 W DC-DC REG PWR SUPPLY MODULE |
| PKR4919BSI | 1-OUTPUT 11 W DC-DC REG PWR SUPPLY MODULE |
| PKR4128BPI | 1-OUTPUT 12 W DC-DC REG PWR SUPPLY MODULE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PKR2610APIA | 制造商:Ericsson 功能描述: |
| PKR2610APIC | 制造商:Ericsson 功能描述: |
| PKR2610ASI | 功能描述:DC/DC转换器 3.3Vdc 2A Isolated Input 18-36V 6.6W RoHS:否 制造商:Murata 产品: 输出功率: 输入电压范围:3.6 V to 5.5 V 输入电压（标称）: 输出端数量:1 输出电压（通道 1）:3.3 V 输出电流（通道 1）:600 mA 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:SMD/SMT 封装 / 箱体尺寸: |
| PKR2610ASIA | 制造商:Ericsson 功能描述: |
| PKR2610ASIB | 制造商:Ericsson 功能描述: |
发布紧急采购，3分钟左右您将得到回复。