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参数资料
| 型号： | PKU4515PILB |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 49.5 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT PACKAGE-8 |
| 文件页数： | 30/38页 |
| 文件大小： | 1098K |
| 代理商： | PKU4515PILB |
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Ericsson Internal
PRODUCT SPECIFICATION
MECHANICAL.
1 (4)
Prepared (also subject responsible if other)
No.
MICJAN
5/1301-BMR 602 Uen
Approved
Checked
Date
Rev
Reference
MPM/BK/E [Magnus Broman]
See §1
2007-12-17
C
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 8 chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN) in excess
of the solder melting temperature, (T
L, 183°C for Sn63Pb37)
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
General reflow process specifications
SnPb eutectic
Pb-free
Average ramp-up (T
PRODUCT)
3°C/s max
Typical solder melting (liquidus)
temperature
T
L
183°C
221°C
Minimum reflow time above T
L
30 s
Minimum pin temperature
T
PIN
210°C
235°C
Peak product temperature
T
PRODUCT
225°C
260°C
Average ramp-down (T
PRODUCT)
6°C/s max
Maximum time 25°C to peak
6 minutes
8 minutes
T
PRODUCT maximum
T
PIN minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT must not exceed 260 °C at any time.
Dry Pack Information
Surface mounted versions of the products are delivered in
standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment
and no longer can be considered dry, the modules must be
baked according to J-STD-033.
Thermocoupler Attachment
Pin 8 for measurement of minimum
solder joint temperature, TPIN
Pin 2 for measurement of maximum peak product
reflow temperature, TP
E
PKU 4000 Series
DC/DC converters, Input 36-75 V, Output 25 A/50 W
EN/LZT 146 308 R4B July 2008
Ericsson Power Modules AB
Technical Specication
36
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相关代理商/技术参数 |
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| PKU451OSI | 制造商:Ericsson 功能描述:- Trays |
| PKU4619PI | 功能描述:DC/DC转换器 63W 2.5V 25A 36-75Vin RoHS:否 制造商:Murata 产品: 输出功率: 输入电压范围:3.6 V to 5.5 V 输入电压（标称）: 输出端数量:1 输出电压（通道 1）:3.3 V 输出电流（通道 1）:600 mA 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:SMD/SMT 封装 / 箱体尺寸: |
| PKU4710 PI | 制造商:Ericsson 功能描述: |
| PKU4710PI | 功能描述:DC/DC转换器 66W 3.3V 20A 36-75Vin RoHS:否 制造商:Murata 产品: 输出功率: 输入电压范围:3.6 V to 5.5 V 输入电压（标称）: 输出端数量:1 输出电压（通道 1）:3.3 V 输出电流（通道 1）:600 mA 输出电压（通道 2）: 输出电流（通道 2）: 安装风格:SMD/SMT 封装 / 箱体尺寸: |
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