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参数资料
| 型号： | PKU4515SIP |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 49.5 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT PACKAGE-8 |
| 文件页数： | 30/38页 |
| 文件大小： | 1050K |
| 代理商： | PKU4515SIP |
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Ericsson Internal
PROD. SPECIFICATION MECHANICAL
1 (4)
Prepared (also subject responsible if other)
No.
MICJAN
5/1301-BMR 602 Uen
Approved
Checked
Date
Rev
Reference
MPM/BK/E (Magnus Broman)
See §1
2007-01-31
B
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb and Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
reflow profiling techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 8 is chosen as reference location for the minimum
pin temperature recommendations since this will likely be the
coolest solder joint during the reflow process.
Pin 8 for measurement of minimum
solder joint temperature, TPIN
Pin 2 for measurement of maximum peak product
reflow temperature, TP
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature (T
L, +183°C for Sn63/Pb37) for
more than 30 seconds, and a peak temperature of +210°C is
recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221°C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Peak Product Temperature Requirements
Pin number 2 is chosen as reference location for the
maximum (peak) allowed product temperature, (T
P), since this
will likely be the warmest part of the product during the reflow
process.
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. A sufficiently extended preheat time is recommended
to ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating it is also recommended to reduce the time in the
reflow zone as much as possible.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
P must not exceed +225°C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +260°C at any time.
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3°C/s max
Solder melting
temperature (typical)
T
L
+183°C
+221°C
Peak product temperature T
P
+225°C
+260°C
Average ramp-down rate
6°C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
Soldering Information — Through Hole Mounting
The through hole mount version of the product is intended for
manual or wave soldering. When wave soldering is used, the
temperature on the pins is specified to maximum 270°C for
maximum 10 seconds.
A maximum preheat rate of 4°C/s and temperature of max of
150°C is suggested. When soldering by hand, care should be
taken to avoid direct contact between the hot soldering iron
tip and the pins for more than a few second
s in order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
E
PKU 4000 PI & SI series
DC/DC converters, Input 36-75 V, Output 25 A/50 W
EN/LZT 146 308 R2B May 2007
Ericsson Power Modules AB
Technical Specication
E
PKU 4000 PI & SI series
DC/DC converters, Input 36-75 V, Output 25 A/50 W
EN/LZT 146 308 R3A May 2007
Ericsson Power Modules AB
Technical Specication
36
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