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| 型号： | PLA170STR |
| 厂商： | IXYS Integrated Circuits Division |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | RELAY OPTOMOS 100MA SP-NO- 6-SMD |
| 标准包装： | 1 |
| 系列： | PLA, OptoMOS® |
| 电路： | SPST-NO（1 Form A） |
| 输出类型： | AC，DC |
| 导通状态电阻： | 50 欧姆 |
| 负载电流： | 100mA |
| 输入电压： | 1.2VDC |
| 电压 - 负载： | 0 ~ 800 V |
| 安装类型： | 表面贴装 |
| 端接类型： | 鸥翼型 |
| 封装/外壳： | 6-SMD（0.300"，7.62mm） |
| 供应商设备封装： | 6-SMD |
| 包装： | 标准包装 |
| 继电器类型： | 继电器 |
| 其它名称： | CLA344DKR |
I NTEGRATED C IRCUITS D IVISION
PLA170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
PLA170 / PLA170S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
PLA170 / PLA170S
Maximum Temperature x Time
250oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e 3
R04
www.ixysic.com
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