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参数资料
| 型号： | PLC18V8ZIA |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | PLD |
| 英文描述： | Zero standby power CMOS versatile PAL devices |
| 中文描述： | OT PLD, 25 ns, PQCC20 |
| 封装： | PLASTIC, MO-047AA, SOT-380-1, LCC-20 |
| 文件页数： | 3/23页 |
| 文件大小： | 225K |
| 代理商： | PLC18V8ZIA |
Philips Semiconductors
Product specification
PLC18V8Z
Zero standby power
CMOS versatile PAL devices
1997 Aug 08
3
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE
RANGE
ORDER CODE
DRAWING
NUMBER
SOT146-1
20-Pin (300mil-wide) Plastic Dual In-Line Package, 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8Z25N
PLC18V8Z25A
SOT380-1
20-Pin (300mil-wide) Plastic Small Outline Large Package
PLC18V8Z25D
SOT163-1
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
PLC18V8Z25DB
SOT339-1
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
Commercial
Temperature Range
±
5% Power Supplies
PLC18V8Z25DH
SOT360-1
20–Pin (300mil–wide) Plastic Dual In–Line Package. 35ns t
PD
20–Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8Z35N
SOT146–1
PLC18V8Z35A
SOT380–1
20–Pin (300mil square) Plastic Small Outline Large Package Package
PLC18V8Z35D
SOT163–1
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
PLC18V8Z35DB
SOT339–1
20–Pin (4.4mm–wide) Plastic Thin shrink Small Outline Package
PLC18V8Z35DH
SOT260–1
20-Pin (300mil-wide) Plastic Dual In-Line Package 25ns t
PD
20-Pin (350mil square) Plastic Leaded Chip Carrier Package
PLC18V8ZIAN
SOT146-1
PLC18V8ZIAA
SOT380-1
20-Pin (300mil-wide) Plastic Small Outline Large Package
PLC18V8ZIAD
SOT163-1
20-Pin (5.3mm-wide) Plastic Shrink Small Outline Package
PLC18V8ZIADB
SOT339-1
20-Pin (4.4mm-wide) Plastic Thin Shrink Small Outline Package
Industrial
Temperature Range
±
10% Power Supplies
PLC18V8ZIADH
SOT360-1
20–Pin (300mil–wide) Plastic Dual In–Line Package, 40ns t
PD
20–Pin (350mil square) Plastic Leaded chip Carrier Package
PLC18V8ZIN
SOT146–1
PLC18V8ZIA
SOT380–1
20–Pin (300mil square) Plastic Small Outline Large Package
PLC18V8ZZID
SOT163–1
20–Pin (5.3mm–wide) Plastic Shrink Small Outline Package
PLC18V8ZIDB
SOT339–1
20–Pin (4.4mm–wide) Plastic Thin Shrink Small Outline Package
PLC18V8ZIDH
SOT360–1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PLC18V8ZIAA | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices |
| PLC18V8ZIAD | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices |
| PLC18V8ZIADB | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices |
| PLC18V8ZIADH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices |
| PLC18V8ZIAN | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Zero standby power CMOS versatile PAL devices |
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