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参数资料
| 型号： | PM50B4LB060 |
| 厂商： | Powerex Inc |
| 文件页数： | 6/6页 |
| 文件大小： | 0K |
| 描述： | MOD PV-IPM H-BRDG 600V 50A |
| 标准包装： | 1 |
| 系列： | Intellimod™ |
| 类型： | IGBT |
| 配置： | 半桥 |
| 电流： | 50A |
| 电压： | 600V |
| 电压 - 隔离： | 2500VDC |
| 封装/外壳： | 模块 |
POWEREX, INC., 200 E. HILLIS STREET, YOUNGWOOD, PENNSYLVANIA 15697-1800 (724) 925-7272
PM50B4LA060 / PM50B4LB060
PHOTO VOLTAIC IPM
H-BRIDGE
50 AMPERES/600 VOLTS
10 1
10 0
SWITCHING TIME VS.
COLLECTOR CURRENT
(TYPICAL - INVERTER PART)
V CC = 300V
V D = 15V
T J = 25°C
T J = 125 O C
INDUCTIVE LOAD
10 0
10 -1
SWITCHING TIME VS.
COLLECTOR CURRENT
(TYPICAL - INVERTER PART)
V CC = 300V
V D = 15V
T J = 25°C
T J = 125°C
10 0
10 -1
SWITCHING TIME VS.
COLLECTOR CURRENT
(TYPICAL - INVERTER PART)
V CC = 300V
V D = 15V
T J = 25°C
T J = 125°C
10 -1
10 -2
INDUCTIVE LOAD
10 -2
INDUCTIVE LOAD
10 0
10 1
10 2
10 0
10 1
10 2
10 0
10 1
10 2
COLLECTOR CURRENT, I C , (AMPERES)
REVERSE RECOVERY LOSS CHARACTERISTICS
(TYPICAL - INVERTER PART)
10 0
10 1
COLLECTOR CURRENT, I C , (AMPERES)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT & FWDI - INVERTER PART)
COLLECTOR CURRENT, I C , (AMPERES)
10 0
10 -1
SINGLE PULSE
10 -1
T C = 25°C
PER UNIT BASE =
10 -2
V CC = 300V
V D = 15V
T J = 25°C
T J = 125°C
INDUCTIVE LOAD
10 -2
R TH(J-C) =
0.95°C/W
(IGBT)
R TH(J-C) =
1.61°C/W
(FWDI)
10 -3
10 0
10 1
10 2
10 -3
10 -3
10 -2
10 -1
10 0
10 1
FORWARD CURRENT, I F , (AMPERES)
PACKAGE A
TIME, (S)
NOTE 1: T C (UNDER THE CHIP) MEASUREMENT POINT
PACKAGE B
Y
X
BOTTOM VIEW
Y
X
BOTTOM VIEW
6
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PM50B4LB060_11 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM50B5L1C060 | 制造商:Powerex Power Semiconductors 功能描述:MOD IPM H-BRIDGE CHOPP 50A 600V 制造商:Powerex Power Semiconductors 功能描述:IGBT Module 制造商:Powerex Power Semiconductors 功能描述:IGBT Module, Transistor Polarity:-, DC Collector Current:50A, Collector Emitter |
| PM50B5LA060 | 功能描述:MOD PV-IPM H-BRDG/CHOP 600V 50A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM50B5LA060_11 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM50B5LB060 | 功能描述:MOD PV-IPM H-BRDG/CHOP 600V 50A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
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