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参数资料
| 型号： | PM600CLA060 |
| 厂商： | Mitsubishi Electric Corporation |
| 英文描述： | INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| 中文描述： | 智能功率模块扁平性基地型绝缘包装 |
| 文件页数： | 1/8页 |
| 文件大小： | 147K |
| 代理商： | PM600CLA060 |
Jul. 2005
MITSUBISHI <INTELLIGENT POWER MODULES>
PM600CLA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM600CLA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1
μ
m fine rule process.
For example, typical V
ce
(sat)=1.8V @Tj=125
°
C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
3
φ
600A, 600V Current-sense IGBT type inverter
Monolithic gate drive & protection logic
Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (Fo available from
all arm devices)
Acoustic noise-less 45kW/55kW class inverter application
UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
Dimensions in mm
3
3
1
1
1
9
8
7
1
2
3
4
5
6
13
14
16
15
17
18
20
19
9.08
21
3-2.54
50
53.75
50
53.75
31.84
3-2.54
3.22
50
21
22
24
23
25
26
28
27
21
3-2.54
31.84
3-2.54
3.22
29
30
32
31
33
34
36
35
21
3-2.54
31.84
3-2.54
3.22
17
12
17
12
17
12
17
12
17
12
17
12
162
172
50
±
0.5
22
6
14
28
22
22
28
50
±
0.5
50
±
0.5
11
8-
φ
5.5
MOUNTING HOLES
6-
φ
2.5
12-M6 NUTS
9
7
5
3.75
1
1
1
1
±
0
9
2
1
5
6
24- 0.64
(SCREWING DEPTH)
L
A
B
E
L
(24)
2
17
6
12
8
φ
3
+1.0
–0.5
(
1. N
2. P
3. N
4. P
5. N
6. P
7. W
8. W
9. V
10. V
11. U
12. U
13. VUPC
14. UPFO
15. UP
16. VUP1
17. VUNC
18. UNFO
19. UN
20. VUN1
21. VVPC
22. VPFO
23. VP
24. VVP1
25. VVNC
26. VNFO
27. VN
28. VVN1
29. VWPC
30. WPFO
31. WP
32. VWP1
33. VWNC
34. WNFO
35. WN
36. VWN1
Terminal code
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PDF描述 |
|---|---|
| PM600HSA120 | CAPACITOR, 0.047UF, 10%, 50VDC, CERAMIC X7R, 0805, SMT |
| PM600HHA060 | TRANSISTOR | IGBT POWER MODULE | INDEPENDENT | 600V V(BR)CES | 600A I(C) |
| PM600DVA060 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM600DSA060 | FLAT-BASE TYPE INSULATED PACKAGE |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PM600DSA060 | 功能描述:MOD IPM DUAL HF 600V 600A RoHS:否 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM600DSA060_00 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM600DV1A060 | 制造商:Powerex Power Semiconductors 功能描述:MOD IPM V1 DUAL 600A 600V 制造商:Powerex Power Semiconductors 功能描述:IGBT Module 制造商:Powerex Power Semiconductors 功能描述:IGBT Module; DC Collector Current:600A; Collector Emitter Voltage Vces:1.85V; Collector Emitter Voltage V(br)ceo:600V; Module Configuration:Dual; Package / Case:120 x 70mm Module |
| PM600DVA060 | 功能描述:MOD IPM HF 600V 600A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM600DVA060_05 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
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