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参数资料
| 型号： | PM75B6L1C060 |
| 元件分类： | 运动控制电子 |
| 英文描述： | AC MOTOR CONTROLLER, DMA19 |
| 封装： | 90 X 50 MM, DMA-19 |
| 文件页数： | 6/12页 |
| 文件大小： | 343K |
| 代理商： | PM75B6L1C060 |
3
MITSUBISHI <INTELLIGENT POWER MODULES>
PM75B6L1C060
FLAT-BASE TYPE
INSULATED PACKAGE
Jan. 2011
CONTROL PART
Symbol
Parameter
Conditions
Ratings
Unit
VD
Supply Voltage
Applied between : VUP1-VUPC, VVP1-VVPC,VN1-VNC
20
V
VCIN
Input Voltage
Applied between : UP-VUPC, VP-VVPC,
UN
VNWNBr-VNC
20
V
VFO
Fault Output Supply Voltage
Applied between : UFo-VUPC, VFo-VVPC, Fo-VNC
20
V
IFO
Fault Output Current
Sink current at UFo, VFo, Fo terminals
20
mA
TOTAL SYSTEM
Symbol
Parameter
Conditions
Ratings
Unit
VCC(PROT)
Supply Voltage Protected by
SC
VD =13.5V ~ 16.5V
Inverter Part, Tj =+125°C Start
450
V
VCC(surge)
Supply Voltage (Surge)
Applied between : P-N, Surge value
500
V
Tstg
Storage Temperature
-40 ~ +125
°C
Visol
Isolation Voltage
60Hz, Sinusoidal, RMS, Charged part to Base, AC 1min.
2500
V
*: TC measurement point is just under the chip.
THERMAL RESISTANCE
Limits
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Rth(j-c)Q
Inverter, IGBT (per 1 element)
(Note.1)
-
0.62
Rth(j-c)D
Inverter, FWDi (per 1 element)
(Note.1)
-
1.06
Rth(j-c)Q
Converter, IGBT (per 1 element)
(Note.1)
-
0.62
Rth(j-c)D
Converter, FWDi (per 1 element)
(Note.1)
-
1.06
Rth(j-c)D
Thermal Resistance
Converter, Di (per 1 element)
(Note.1)
-
1.06
Rth(c-s)
Contact Thermal Resistance
Case to heat sink, (per 1 module)
Thermal grease applied
(Note.1)
-
0.06
-
K/W
Note.
1: If you use this value, Rth(s-a) should be measured just under the chips.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PM75B6LA060 | 功能描述:MOD IPM L-SERIES 600V 75A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM75B6LA060_09 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM75B6LB060 | 功能描述:MOD IPM L-SERIES 600V 75A RoHS:是 类别:半导体模块 >> 功率驱动器 系列:Intellimod™ 标准包装:15 系列:SPM® 类型:FET 配置:三相反相器 电流:1.8A 电压:500V 电压 - 隔离:1500Vrms 封装/外壳:23-DIP 模块 |
| PM75B6LB060_09 | 制造商:MITSUBISHI 制造商全称:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE |
| PM75CBS060 | 制造商:POWEREX 制造商全称:Powerex Power Semiconductors 功能描述:Intellimod⑩ Module MAXISS Series⑩ Multi AXIS Servo IPM (75 Amperes/600 Volts) |
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