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参数资料
| 型号： | PMA5319SF/C |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 30 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | SMT-14 |
| 文件页数： | 5/15页 |
| 文件大小： | 289K |
| 代理商： | PMA5319SF/C |
13
PMA 5000 Series Datasheet
EN/LZT 146 034 R1B Ericsson Power Modules, November 2003
Miscellaneous
The PMA 5000 series DC/DC regulators are intended for
reflow soldering processes. Extra precautions must be taken
when reflow-soldering the module. Neglecting the soldering
information provided may result in permanent damage or
significant degradation of the regulator performance. No
responsibility is assumed if these recommendations are not
strictly followed.
The regulator may be reflow soldered using vapour phase
reflow (VPR) or forced convection reflow processes. The
high thermal mass of the component and its effect on the
temperature differences (
T) over a PCB means that particular
attention should be paid to other temperature sensitive
components.
For successful soldering of the PMA 5000 series DC/DC
regulators, both pin temperature and case temperature must be
monitored:
Minimum temperature of the pins:
to ensure reliable solder joints
Maximum temperature of the regulator case:
to avoid overheating
Soldering Information
Minimum temperature:
Most important is to ensure that the pins on the coolest side
reach sufcient soldering temperature for a sufcient time.
Therefore, the pin temperature measurements should be done
on both sides of the module, preferrably on the middle pins
(3/4 and 11/12).
The pins of the module are palladium plated. In order to
guarantee a reliable solder joint, a pin temperature (TP) in
excess of the solder fusing temperatue (183C for Sn/Pb 63/37)
for 25 seconds, and a peak temperature above 195C should be
reached.
Maximum temperature:
To avoid damage to the module, the reow prole should
be optimised to avoid overheating. The case temperature
(TC) should be monitored with a thermocouple attached to
the center of the top of the case using an adhesive or heat
conductive paste.
A sufciently extended soak time is recommended to ensure
an even temperature throughout the PCB, for both small
and large components. To reduce the risk of overheating the
module it is also recommended to minimise the time in reow
as much as possible.
Conventional Sn-Pb convection solder process
For conventional Sn-Pb solder processes, the PMA 5000 series
regulator is qualied for MSL 1 according to Jedec standard
(J-STD-020b July 2002).
During reow, the case temperature must not exceed 215C at
any time.
0
70
140
210
280
350
0
50
100
150
200
250
300
[°C]
Time
reflow ramp-
up max 3°/s
cooling
max 5°/s
preheat
max 3°/s
soak zone (150°C-
180°C) 30-180s
reflow
zone
max case temperature
@ 215°C (Sn-Pb solders)
pin temperature
case temperature
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