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参数资料
| 型号： | PMC8518TSN |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT PACKAGE-6 |
| 文件页数： | 26/34页 |
| 文件大小： | 951K |
| 代理商： | PMC8518TSN |
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Ericsson Internal
PROD. SPECIFICATION MECHANICAL
1 (4)
Prepared (also subject responsible if other)
No.
EPANHON
5/1301-BMR619 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Linda Zhong)
See §1
2006-12-15
A
Soldering Information - Surface Mounting
The product is intended for convection or vapor phase reflow
SnPb or Pb-free processes. To achieve a good and reliable
soldering result, make sure to follow the recommendations
from the solder paste supplier, to use state-of-the-art reflow
equipment and reflow profiling techniques as well as the
following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendations since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature, (T
L, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to
+221 °C for Sn/Ag/Cu solder alloys) for more than 30
seconds, and a peak temperature of +235°C on all solder
joints is recommended to ensure a reliable solder joint.
Peak Product Temperature Requirements
Main transformer is chosen as reference location for the
maximum (peak) allowed product temperature since this will
likely be the warmest parts of the product during the reflow
process.
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. A sufficiently extended preheat time is recommended
to ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
P must not exceed +225 °C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 1 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +245 °C at any time.
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3 °C/s max
Solder melting
temperature (typical)
T
L
+183 °C
+217 °C
Peak product temperature T
P
+225 °C
1
+245 °C
Average ramp-down rate
6 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
Main transformer for
Measurement of Max
product temperature, TP
PIN 4for measurement of
minimum solder joint
temperature, TPIN
E
PMC 8518 series
POL regulator, Input 12 V, Output 10 A/50 W
EN/LZT 146 063 R3A Aug 2007
Ericsson Power Modules AB
Technical Specication
32
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