参数资料
型号: PMEG3020EJ,115
厂商: NXP Semiconductors
文件页数: 3/9页
文件大小: 106K
描述: SCHOTTKY RECT 30V 2A SOD323F
产品目录绘图: SOD-323 Circuit
标准包装: 3,000
二极管类型: 肖特基
电压 - (Vr)(最大): 30V
电流 - 平均整流 (Io): 2A(DC)
电压 - 在 If 时为正向 (Vf)(最大): 620mV @ 2A
速度: 快速恢复 =< 500 ns,> 200mA(Io)
电流 - 在 Vr 时反向漏电: 1mA @ 30V
电容@ Vr, F: 72pF @ 1V,1MHz
安装类型: 表面贴装
封装/外壳: SC-90,SOD-323F
供应商设备封装: SOD-323F
包装: 带卷 (TR)
其它名称: PMEG3020EJ115-CHP
PMEG3020EH_EJ_4
? NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 04 — 4 February 2010 3 of 9
NXP Semiconductors
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF
MEGA Schottky barrier rectifiers
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] For Schottky barrier diodes thermal run-away has to
be considered, as in some applications the reverse
power losses PR
are a significant part of the total power
losses. Nomograms for determining the reverse
power losses PR
and I
F(AV)
rating will be av
ailable on request.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm2.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage - 30 V
IF
forward current Tsp
55
°C-2A
IFRM
repetitive peak forward
current
tp
1 ms; δ≤0.25 - 4.5 A
IFSM
non-repetitive peak forward
t = 8 ms; square
current
wave
[1]
-9A
Ptot
total power dissipation Tamb
25 °C
PMEG3020EH
[1]
- 375 mW
[2]
- 830 mW
PMEG3020EJ
[1]
- 360 mW
[2]
- 830 mW
Tj
junction temperature - 150
°C
Tamb
ambient temperature
?65 +150
°C
Tstg
storage temperature
?65 +150
°C
Table 7. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
PMEG3020EH
[1][2]
--330K/W
[2][3]
--150K/W
PMEG3020EJ
[1][2]
--350K/W
[2][3]
--150K/W
Rth(j-sp)
thermal resistance from
junction to solder point
PMEG3020EH - - 60 K/W
PMEG3020EJ - - 55 K/W
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