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参数资料
| 型号： | PMG4318TP |
| 厂商： | ERICSSON POWER MODULES AB |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 37.5 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, 10 PIN |
| 文件页数： | 19/29页 |
| 文件大小： | 581K |
| 代理商： | PMG4318TP |
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Ericsson Internal
PRODUCT SPECIFICATION
3 (7)
Prepared (also subject responsible if other)
No.
SEC/D EPANHON
4/1301-BMR 644
Approved
Checked
Date
Rev
Reference
SEC/D (Linad Zhong)
See end
2006-2-14
B
Soldering Information - Surface mounting
The surface mount version of the product is intended for
convection or vapor phase reflow Pb-free processes. To
achieve a good and reliable soldering result, make sure to
follow the recommendations from the solder paste supplier,
to use state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC regulator. The
cleaning residues may affect long time reliability and isolation
voltage.
Minimum pin temperature recommendations
Pin number 9 is chosen as reference location for the minimum
pin temperature recommendations since this will be the
coolest solder joint during the reflow process.
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature, (T
L, +183 °C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of
+210 °C is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235 °C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum regulator temperature requirements
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. The maximum product temperature shall be
monitored by attaching a thermocoupler to the top of the
main transformer.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
P must not exceed +225 °C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
P must not exceed +260 °C at any time.
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3 °C/s max
Solder melting
temperature (typical)
T
L
+183 °C
+221 °C
Peak product temperature T
P
+225 °C
+260 °C
Average ramp-down rate
6 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
PIN 9 for measurement of
minimum solder joint
temperature, T
PIN
Main transformer for
measurement of Max
product temperature, T
P
E
PMG 4000 series
POL regulator, Input 2.95-3.65 V, Output 15 A/37.5 W
EN/LZT 146 319 R1B April 2006
Ericsson Power Modules AB
Technical Specication
26
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