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参数资料
| 型号： | PN-DESIGNKIT-28 |
| 厂商： | Bourns Inc. |
| 文件页数： | 1/5页 |
| 文件大小： | 0K |
| 描述： | KIT SATA HDD DATA/PWR PROTECT |
| 标准包装： | 1 |
| 系列： | PortNote™ |
| 套件类型： | SATA HDD 接口数据和电源保护 |
| 套件包括： | 15 件 - 3 种值 |
| 包装： | 带装箱指南的塑料箱 |
| 工具箱内容： | (5) SMBJ5.0ABCT-ND - DIODE TVS 5.0V 600W UNI 5% SMD (5) MF-MSMF075/24-2CT-ND - PTC RESETTABLE .75A 24V 1812 |
Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Quali?cation for Passive Components
in Automotive Applications
■ 100 % electrically compatible with all
previous generations of 1812 SMT devices
■ Compatible with Pb and Pb-free solder
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 4532 mm (1812 mils) footprint
■ Patents pending
re?ow pro?les
■ RoHS compliant* and halogen free**
MF-MSMF Series - PTC Resettable Fuses
Electrical Characteristics
Model
V max.
Volts
I max.
Amps
Ihold Itrip
Amperes
at 23 °C
Resistance
Ohms
at 23 °C
Max. Time
To Trip
Amperes Seconds
at 23 °C
at 23 °C
Tripped
Power
Dissipation
Watts
at 23 °C
Hold Trip
RMin.
R1Max.
Typ.
MF-MSMF010
MF-MSMF014
MF-MSMF020
MF-MSMF020/60
MF-MSMF030
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF110/24X
MF-MSMF125
MF-MSMF150
MF-MSMF150/24X
MF-MSMF160
MF-MSMF200
MF-MSMF250/16X
MF-MSMF260
60.0
60.0
30.0
60.0
30.0
15.0
13.2
24.0
6.0
16.0
24.0
6.0
6.0
24.0
8.0
8.0
16.0
6.0
40
40
80
40
10
100
100
40
100
100
20
100
100
20
100
40
100
100
0.10 0.30
0.14 0.34
0.20 0.40
0.20 0.40
0.30 0.60
0.50 1.00
0.75 1.50
0.75 1.50
1.10 2.20
1.10 2.20
1.10 2.20
1.25 2.50
1.50 3.00
1.50 3.00
1.60 2.80
2.00 4.00
2.50 5.00
2.60 5.20
0.70 15.00
0.40 6.50
0.40 6.00
0.40 6.00
0.30 3.00
0.15 1.00
0.11 0.45
0.11 0.45
0.04 0.21
0.04 0.21
0.06 0.18
0.035 0.14
0.03 0.120
0.03 0.120
0.035 0.099
0.020 0.080
0.015 0.100
0.015 0.080
0.5
1.5
6.0
1.5
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
1.50
0.15
0.06
0.15
0.10
0.15
0.20
0.20
0.30
0.30
0.50
0.40
0.5
1.50
2.0
3.0
5.0
5.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.0
0.8
0.8
1.2
0.8
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-MSMF Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At speci?ed current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certi?cations, then UL File No., enter E174545
CSA File Number .................................................. CA110338
http://directories.csa-international.org/ Under “Certi?cation Record” and “File Number”
enter 110338-0-000
TüV Certi?cate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certi?cates”, enter File No. 2057213
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns is using the de?nition that appears to be the prevalent de?nition used as the industry standard at this time. The Bourns de?nition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤ 1500 ppm.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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