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| 型号： | PR29MF21NSZF |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | RELAY SSR 120VAC .9A ZC 8-DIP |
| 产品目录绘图： | PRxxMF Series Circuit |
| 标准包装： | 50 |
| 系列： | PR29MF |
| 电路： | SPST-NO（1 Form A） |
| 输出类型： | AC，过零 |
| 负载电流： | 900mA |
| 输入电压： | 1.2VDC |
| 电压 - 负载： | 0 ~ 120 V |
| 安装类型： | 通孔 |
| 端接类型： | PC 引脚 |
| 封装/外壳： | 8-DIP（0.300"，7.62mm），7 引线 |
| 供应商设备封装： | 8-DIP |
| 包装： | 管件 |
| 继电器类型： | 继电器 |
| 产品目录页面： | 2634 (CN2011-ZH PDF) |
| 其它名称： | 425-2365-5 |
PR29MF1xNSZ Series/PR39MF1xNSZ Series/PR49MF11NSZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(?C)
300
Terminal : 260?C peak
( package surface : 250?C peak)
200
Reflow
220?C or more, 60s or less
100
Preheat
150 to 180?C, 120s or less
0
0
1
2
3
4
(min)
Flow Soldering :
Flow soldering should be completed below 270?C and within 10s.
Preheating is within the bounds of 100 to 150?C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400?C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A00601EN
11
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