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| 型号： | PS5164 |
| 厂商： | Microchip Technology |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | MODULE BATTERY MGR W/LED DISPLAY |
| 标准包装： | 1 |
| 模块/板类型： | 电池管理器模块 |
| 适用于相关产品： | 4 芯锂离子/聚合物电量计 |
PS5164
1.0
GENERAL DESCRIPTION
Step 1)
Configure the module for optional external
thermistor use. PS5164 modules are shipped
The PS5164 module is a complete smart battery
controller subsystem based on the Microchip PS501
field reprogrammable battery manager with patented
Accuron ? technology. The module is designed to
configured to use the internal temperature
sensor only. To add an external thermistor to
the board, remove resistor R16 (side 2) and
connect the thermistor across via TN and TR.
operate in a battery pack consisting of four (4) series
connected Li-based cells. The module consists of the
Microchip PS501 battery manager IC with a four-LED
SOC display and an optional connection for an external
thermistor.
Step 2)
Step 3)
Connect wires to module. Use large diameter
wire (18 AWG-20 AWG) for current carrying
lines from VR, V1, B+ and BN. All others are
signal only lines (24 to 22 AWG).
Connect external connector to BN, T, C, D
1.1
Quick Start – Pack Assembly
Step 4)
and B+.
Connect V1 to the most positive point on the
Follow these directions to assemble a pack with the
battery cell stack.
PS5164 module.
? Use standard precautions when handling static
sensitive devices.
? Modules should be connected to battery cells in
the order indicated below to insure proper start-up
and operation. Wires should be attached to the
modules first and then connected to the battery
cells as instructed.
? The connection sequence is critical to successful
use of the PS501 family of CMOS ASICs. The
pack positive should be securely connected to the
module first, followed by the intermediate cells
from most positive to least positive and finally,
pack negative.
Step 5)
Step 6)
Step 7)
Step 8)
Connect the negative end of the top-most cell
to V2, the negative end of the next cell to V3
and the negative end of the third cell to V4.
Connect VR to the most negative point on the
battery cell stack.
Program the assembled pack using
Microchip’s software and PowerCal? board
or PowerInfo? board hardware.
The memory parameters can be changed at
will using the utilities on the memory page in
the software.
Calibrate the pack using the software and
PowerCal? board hardware. The pack is
now ready for use.
FIGURE 1-1:
DS21850B-page 2
CONNECTION POINTS (SIDE 1)
? 2004 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
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| PS51789 | 制造商:Powerex Power Semiconductors 功能描述:MOD DIP PFC 30A 600V MINI-DIP 制造商:Powerex Power Semiconductors 功能描述:INTELLIGENT POWER MODULE, IGBT, 30A, 600V, DIP; IPM Power Device:IGBT; Voltage Rating (Vces / Vdss):600V; Current Rating (Ic / Id):30A; Isolation Voltage:2500Vrms; IPM Mounting Type:PCB; IPM Case Style:DIP; IPM Series:Intellimod 制造商:Powerex Power Semiconductors 功能描述:POWER IPM TRANSISTOR |
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