参数资料
| 型号： | PS9151-F3-AX |
| 厂商： | CEL |
| 文件页数： | 10/14页 |
| 文件大小： | 0K |
| 描述： | ISOLATOR 3.75KVRMS 1CH OPEN 5SOP |
| 标准包装： | 2,500 |
| 系列： | NEPOC |
| 电压 - 隔离： | 3750Vrms |
| 通道数： | 1，单向 |
| 电流 - 输出 / 通道： | 2mA |
| 数据速率： | 15Mbps |
| 传输延迟高 - 低 @ 如果： | 35ns @ 10mA |
| 电流 - DC 正向(If)： | 16mA |
| 输入类型： | DC |
| 输出类型： | 推挽式/图腾柱 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-SOIC（0.173"，4.40mm 宽，5 引线） |
| 供应商设备封装： | 5-SOP |
| 包装： | 带卷 (TR) |
| 其它名称： | PS9151-F3-AX-ND PS9151-F3-AXTR |
PS9151
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
? Peak reflow temperature
? Time of peak reflow temperature
? Time of temperature higher than 220 ° C
? Time to preheat temperature from 120 to 180 ° C
? Number of reflows
? Flux
260 ° C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260?C MAX.
220?C
to 60 s
180?C
120?C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
? Temperature
? Time
? Preheating conditions
? Number of times
? Flux
260 ° C or below (molten solder temperature)
10 seconds or less
120 ° C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
? Peak temperature (lead part temperature) 350 ° C or below
? Time (each pins)
? Flux
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100 ° C.
10
Data Sheet PN10659EJ02V0DS
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