参数资料
型号: PT480FE0000F
厂商: Sharp Microelectronics
文件页数: 5/7页
文件大小: 0K
描述: PHOTO TRANS BLACK LEN 860NM SIDE
标准包装: 2,000
系列: *
电压 - 集电极发射极击穿(最大): 35V
电流 - 集电极 (Ic)(最大): 20mA
电流 - 暗 (Id)(最大): 100µA
波长: 860nm
视角: 70°
功率 - 最大: 75mW
安装类型: 通孔
方向: 侧视图
封装/外壳: 径向
其它名称: 425-2380-5
PT480FE0000F
■ Packing Specifications
1. Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag.
2. Bags are secured in a box as shown in the illustration on PAGE CROSSREFERENCE.
3. Product mass: 0.09 g (approximately)
■ Design Notes
1. This product is not designed to resist electromagnetic and ionized-particle radiation.
■ Manufacturing Guidelines
● Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
● Soldering Instructions
1. Sharp does not recommend using preheat or solder reflow methods when soldering this part.
2. If hand soldering, use temperatures ≤ 260°C for ≤ 5 seconds.
3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the
solder, the pad, and the circuit board.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 4 Soldering Area
1.4 mm
Soldera b le
Sheet No.: D1-A02001EN
5
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