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PT7681—5V
Typical Characteristics
Specifications (Unless otherwise stated, Ta =25°C, Vin =5V, Cin =1,500F, Cout =330F, Vo =3.3V, and Io =Iomax)
PT7681
Characteristics
Symbols
Conditions
Min
Typ
Max
Units
Output Current
Io
Ta = 60°C, 200LFM, pkg N
0
—
30
A
Ta = 25°C, Natural convection
0
—
29
Input Voltage Range
Vin
Over Io range
4.5
—
5.5
V
Set-Point Voltage Tolerance
Vo tol
All output voltages
—
±10
±25 (1)
mV
Temperature Variation
Regtemp
–40°C
=Ta =+85°C, Io =Iomin
—
±1
—
%Vo
Line Regulation
Regline
Over Vin range
—
±5
—
mV
Load Regulation
Regload
Over Io range
—
±5
—
mV
Total Output Voltage Variation
. Vo tol
Includes set-point, line, load,
—
±1.5
±3
%Vo
–40°C
=Ta =+85°C
Efficiency
.
Io =15A
Vo =3.3V
—
93
—
Vo =2.5V
—
92
—
%
Vo =1.8V
—
89
—
Io =30A
Vo =3.3V
—
90
—
Vo =2.5V
—
87
—
%
Vo =1.8V
—
83
—
Vo Ripple (pk-pk)
Vr
20MHz bandwidth
—
40
—
mVpp
Transient Response
ttr
1A/s load step, 50% and 100% Iomax
—
25
—
Sec
Vos
Vo over/undershoot
—
±200 (2)
—mV
Over-Current Threshold
ITRIP
Reset followed by auto-recovery
—
38
—
A
Output Margin Adjust
Vo adj
Pin 6 or 26 connected to pin 12
—
±5
—
%
Switching Frequency
s
Over Vin range
250
300
350
kHz
STBY* Input Requirements
Input High Voltage
VIH
Referenced to GND
2.0
—
Open (3)
V
Input Low Voltage
VIL
-0.2
—
0.8
Input Low Current
IIL
Pin 5 to GND
—
0.3
—
mA
Standby Input Current
Iin standby
Pin 5 to GND
—
6
—
mA
External Capacitance
Cout
330 (4)
—
15,000
F
Operating Temperature Range
Ta
Over Vin Range
–40
—
85 (5)
°C
Solder Reflow Temperature
Treflow
Surface temperature of module pins or case
—
215 (6)
°C
Storage Temperature
Ts
—
–40
—
125
°C
Mechanical Shock
—
Per Mil-STD-883D, Method 2002.3
—
500
—
G’s
1 msec, Half Sine, mounted to a fixture
Mechanical Vibration
—
Mil-STD-883D, Method 2007.2
Suffix A
—
20
(7)
—
G’s
20-2000 Hz
Suffixes N,C
—
TBD (7)
—
Weight
—
Vertical/Horizontal
—
36
—
grams
Flammability
—
Materials meet UL 94V-0
Notes: (1) If the remote sense ground is not used, pin 12 must be connected to pin 13 for optimum output voltage accuracy.
(2) The transient response may be improved by placing additional capacitors with low equivalent series resistance (ESR) on the output.
(3) The STBY* control (pin 5) has an internal pull-up. If it is left open-circuit, the module will operate when input power is applied. A low-leakage (<1A)
MOSFET must be used to control this pin. The open-circuit voltage may be as high as Vin.
(4) For operation below 0°C, Cin and Cout must have stable characteristics. Use either low ESR tantalum or Oscon capacitors.
(5) See safe Operating Area curves or consult factory for the appropriate derating.
(6) During reflow of SMD package version do not elevate the module case, pins, or internal component temperatures above a peak of 215°C. For further
guidance refer to the application note, “Reflow Soldering Requirements for Plug-in Power Surface Products,” (SLTA051).
(7) The case pins on the through-hole package types (suffixes N & A) must be soldered. For more information see the applicable package outline drawing.
External Capacitors: The regulator require a minimum output capacitance of 330F for proper operation. An input capacitance of 1500F is also required. This
must be rated for a minimum of 1.1Arms of ripple current. For transient or dynamic load applications, additional capacitance may be required. For further informa-
tion refer to the application note regarding capacitor selection for this product.
Input Filter: An input filter inductor is optional for most applications. The inductor must be sized to handle 30ADC with a typical value of 1H.
30-A Programmable ISR
With Margin Up/Down Controls
SLTS177
B - DECEMBER 2002 - REVISED JULY 2006